Alexandre Vaufredaz

Person

La Murette, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Process for fabricating a multilayer structure with trimming using...
- Patent number 8,372,728
- Issue date Feb 12, 2013
- Soitec
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a heterostructure with minimized stress
- Patent number 8,314,007
- Issue date Nov 20, 2012
- Soitec
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a multilayer structure with post-grinding t...
- Patent number 8,298,916
- Issue date Oct 30, 2012
- Soitec
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for bonding by molecular adhesion
- Patent number 8,158,013
- Issue date Apr 17, 2012
- Soitec
- Sebastien Kerdiles
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Equipment for bonding by molecular adhesion
- Patent number 8,091,601
- Issue date Jan 10, 2012
- S.O.I. Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Process and equipment for bonding by molecular adhesion
- Patent number 7,601,271
- Issue date Oct 13, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
Preparing a Surface of a Sapphire Substrate for Fabricating Heteros...
- Publication number 20120015497
- Publication date Jan 19, 2012
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A MULTILAYER STRUCTURE WITH POST-GRINDING T...
- Publication number 20110230003
- Publication date Sep 22, 2011
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A MULTILAYER STRUCTURE WITH TRIMMING USING...
- Publication number 20110230005
- Publication date Sep 22, 2011
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SILICON-ON-SAPPHIRE TYPE HETEROSTRUCTURE
- Publication number 20110195560
- Publication date Aug 11, 2011
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A HETEROSTRUCTURE WITH MINIMIZED STRESS
- Publication number 20110151644
- Publication date Jun 23, 2011
- Alexandre Vaufredaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIPMENT FOR BONDING BY MOLECULAR ADHESION
- Publication number 20090294072
- Publication date Dec 3, 2009
- S.O.I.Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR BONDING BY MOLECULAR ADHESION
- Publication number 20090261064
- Publication date Oct 22, 2009
- S.O.I.Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and equipment for bonding by molecular adhesion
- Publication number 20070119812
- Publication date May 31, 2007
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS

Alexandre Vaufredaz

Person

Patents Grantslast 30 patents

Process for fabricating a multilayer structure with trimming using...

Process for fabricating a heterostructure with minimized stress

Process for fabricating a multilayer structure with post-grinding t...

Process for bonding by molecular adhesion

Equipment for bonding by molecular adhesion

Process and equipment for bonding by molecular adhesion

Patents Applicationslast 30 patents

Preparing a Surface of a Sapphire Substrate for Fabricating Heteros...

PROCESS FOR FABRICATING A MULTILAYER STRUCTURE WITH POST-GRINDING T...

PROCESS FOR FABRICATING A MULTILAYER STRUCTURE WITH TRIMMING USING...

METHOD OF PRODUCING A SILICON-ON-SAPPHIRE TYPE HETEROSTRUCTURE

PROCESS FOR FABRICATING A HETEROSTRUCTURE WITH MINIMIZED STRESS

EQUIPMENT FOR BONDING BY MOLECULAR ADHESION

PROCESS FOR BONDING BY MOLECULAR ADHESION

Process and equipment for bonding by molecular adhesion