Alexandros P. Papavasiliou

Person

Thousand Oaks, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through-substrate vias formed by bottom-up electroplating
- Patent number 10,699,954
- Issue date Jun 30, 2020
- Teledyne Scientific & Imaging, LLC
- Alexandros Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical capacitor contact arrangement
- Patent number 10,084,035
- Issue date Sep 25, 2018
- Teledyne Scientific & Imaging, LLC
- Alexandros P. Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical optical shutter system
- Patent number 8,941,907
- Issue date Jan 27, 2015
- Teledyne Scientific & Imaging, LLC
- Alexandros P. Papavasiliou
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Micro-scale system to provide thermal isolation and electrical comm...
- Patent number 8,937,513
- Issue date Jan 20, 2015
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated inductors with through-wafer vias
- Patent number 8,826,514
- Issue date Sep 9, 2014
- Teledyne Scientific & Imaging, LLC
- Alexandros Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging array device structure with separate charge storage capacit...
- Patent number 8,742,308
- Issue date Jun 3, 2014
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- G05 - CONTROLLING REGULATING
Information Patent Grant
Micro-scale system to provide thermal isolation and electrical comm...
- Patent number 8,456,249
- Issue date Jun 4, 2013
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate vias with polymer fill and method of fabricating...
- Patent number 8,187,972
- Issue date May 29, 2012
- Teledyne Scientific & Imaging, LLC
- Philip A. Stupar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating vertical capacitors in through-substrate vias
- Patent number 8,088,667
- Issue date Jan 3, 2012
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D Heterogeneously Integrated Power Electronic Building Blocks
- Publication number 20250033954
- Publication date Jan 30, 2025
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Vivek Mehrotra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE VIAS FORMED BY BOTTOM-UP ELECTROPLATING
- Publication number 20190326171
- Publication date Oct 24, 2019
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Alexandros Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CAPACITOR CONTACT ARRANGEMENT AND FABRICATION METHOD
- Publication number 20170194418
- Publication date Jul 6, 2017
- Teledyne Scientific & Imaging, LLC
- Alexandros P. Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-scale System to Provide Thermal Isolation and Electrical Comm...
- Publication number 20130293314
- Publication date Nov 7, 2013
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-scale System to Provide Thermal Isolation and Electrical Comm...
- Publication number 20120286884
- Publication date Nov 15, 2012
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL OPTICAL SHUTTER SYSTEM
- Publication number 20120162741
- Publication date Jun 28, 2012
- Teledyne Scientific & Imaging, LLC
- Alexandros P. Papavasiliou
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Imaging Array With Separate Charge Storage Capacitor Layer
- Publication number 20120153122
- Publication date Jun 21, 2012
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- G05 - CONTROLLING REGULATING
Information Patent Application
MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS
- Publication number 20110131798
- Publication date Jun 9, 2011
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Alexandros Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIAS WITH POLYMER FILL AND METHOD OF FABRICATING...
- Publication number 20110121427
- Publication date May 26, 2011
- Teledyne Scientific & Imaging, LLC
- Philip A. Stupar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS
- Publication number 20100225436
- Publication date Sep 9, 2010
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Alexandros Papavasiliou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical capacitors and method of fabricating same
- Publication number 20100110607
- Publication date May 6, 2010
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-substrate vias and method of fabricating same
- Publication number 20100001378
- Publication date Jan 7, 2010
- Teledyne Scientific & Imaging, LLC
- Jeffrey F. DeNatale
- H01 - BASIC ELECTRIC ELEMENTS

Alexandros P. Papavasiliou

Person

Patents Grantslast 30 patents

Through-substrate vias formed by bottom-up electroplating

Vertical capacitor contact arrangement

Microelectromechanical optical shutter system

Micro-scale system to provide thermal isolation and electrical comm...

Microfabricated inductors with through-wafer vias

Imaging array device structure with separate charge storage capacit...

Micro-scale system to provide thermal isolation and electrical comm...

Through-substrate vias with polymer fill and method of fabricating...

Method of fabricating vertical capacitors in through-substrate vias

Patents Applicationslast 30 patents

3D Heterogeneously Integrated Power Electronic Building Blocks

THROUGH-SUBSTRATE VIAS FORMED BY BOTTOM-UP ELECTROPLATING

VERTICAL CAPACITOR CONTACT ARRANGEMENT AND FABRICATION METHOD

Micro-scale System to Provide Thermal Isolation and Electrical Comm...

Micro-scale System to Provide Thermal Isolation and Electrical Comm...

MICROELECTROMECHANICAL OPTICAL SHUTTER SYSTEM

Imaging Array With Separate Charge Storage Capacitor Layer

MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS

THROUGH-SUBSTRATE VIAS WITH POLYMER FILL AND METHOD OF FABRICATING...

MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS

Vertical capacitors and method of fabricating same

Through-substrate vias and method of fabricating same