Alfons Vindasius

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly having stacked die mounted on substrate
- Patent number 8,357,999
- Issue date Jan 22, 2013
- Vertical Circuits (Assignment for the Benefit of Creditors), LLC
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die assembly having electrical interconnect
- Patent number 7,535,109
- Issue date May 19, 2009
- Vertical Circuits, Inc.
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive epoxy flip-chip on chip
- Patent number 6,271,598
- Issue date Aug 7, 2001
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect process for silicon segments with dielectric...
- Patent number 6,255,726
- Issue date Jul 3, 2001
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming vertical interconnect process for silicon segmen...
- Patent number 6,177,296
- Issue date Jan 23, 2001
- Cubic Memory Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect process for silicon segments with thermally c...
- Patent number 6,124,633
- Issue date Sep 26, 2000
- Cubic Memory
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive epoxy flip-chip on chip
- Patent number 6,098,278
- Issue date Aug 8, 2000
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming vertical interconnect process for silicon segmen...
- Patent number 6,080,596
- Issue date Jun 27, 2000
- Cubic Memory Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming vertical interconnect process for silicon segmen...
- Patent number 5,891,761
- Issue date Apr 6, 1999
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS

Alfons Vindasius

Person

Patents Grantslast 30 patents

Assembly having stacked die mounted on substrate

Die assembly having electrical interconnect

Conductive epoxy flip-chip on chip

Vertical interconnect process for silicon segments with dielectric...

Method for forming vertical interconnect process for silicon segmen...

Vertical interconnect process for silicon segments with thermally c...

Method for forming conductive epoxy flip-chip on chip

Method for forming vertical interconnect process for silicon segmen...

Method for forming vertical interconnect process for silicon segmen...