Alfred Haimerl

Person

Sinzing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Smart card module, smart card, and method for producing a smart car...
- Patent number 10,198,684
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 10,128,180
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages, chip arrangements, a circuit board, and methods for...
- Patent number 9,859,198
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method for producing a chip arrangement
- Patent number 9,633,927
- Issue date Apr 25, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method for producing a chip arrangement
- Patent number 8,519,547
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic-thermosetting composite and method for bonding a ther...
- Patent number 8,507,080
- Issue date Aug 13, 2013
- Infineon Technologies AG
- Joachim Mahler
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor component and production method
- Patent number 8,440,733
- Issue date May 14, 2013
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a stack of semiconductor chips and m...
- Patent number 8,354,299
- Issue date Jan 15, 2013
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and production method
- Patent number 8,178,390
- Issue date May 15, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and method for producing a chip arrangement
- Patent number 8,129,831
- Issue date Mar 6, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with at least two substrates
- Patent number 8,017,438
- Issue date Sep 13, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device in lead frame employing connecting eleme...
- Patent number 8,013,441
- Issue date Sep 6, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement comprising a carrier
- Patent number 7,911,039
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip comprising a metal coating structure and associa...
- Patent number 7,880,300
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer between interfaces of different components in semiconductor d...
- Patent number 7,834,467
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Michael Bauer
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of producing an electronic component with flexible bonding
- Patent number 7,820,482
- Issue date Oct 26, 2010
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having discrete components and method for prod...
- Patent number 7,795,727
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component including semiconductor chip and method for...
- Patent number 7,768,107
- Issue date Aug 3, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sensor chip, and method for producing...
- Patent number 7,749,797
- Issue date Jul 6, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic housing composition for embedding semiconductor devices in...
- Patent number 7,728,053
- Issue date Jun 1, 2010
- Infineon Technologies, AG
- Michael Bauer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic module with a semiconductor chip and a component housing...
- Patent number 7,714,422
- Issue date May 11, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with semiconductor chip and method for produci...
- Patent number 7,705,436
- Issue date Apr 27, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining a thermoplastic material to a thermoset material,...
- Patent number 7,645,642
- Issue date Jan 12, 2010
- Infineon Technologies AG
- Michael Bauer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor sensor component including a sensor chip and methods...
- Patent number 7,629,660
- Issue date Dec 8, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a stress buffer
- Patent number 7,612,457
- Issue date Nov 3, 2009
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure for a semiconductor component and method for produci...
- Patent number 7,589,403
- Issue date Sep 15, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with strip conductors formed of carbon nano...
- Patent number 7,504,711
- Issue date Mar 17, 2009
- Infineon Technologies AG
- Gottfried Beer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor component with a cavity housing and a sensor chip and method...
- Patent number 7,464,603
- Issue date Dec 16, 2008
- Infineon Technologies AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component comprising flip chip contacts with polymer...
- Patent number 7,462,940
- Issue date Dec 9, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductor tracks between semiconductor ch...
- Patent number 7,443,019
- Issue date Oct 28, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20180096924
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART CARD MODULE, SMART CARD, AND METHOD FOR PRODUCING A SMART CAR...
- Publication number 20150339565
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Frank PUESCHNER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20150097282
- Publication date Apr 9, 2015
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...
- Publication number 20140001622
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT
- Publication number 20130328206
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT
- Publication number 20130062781
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD
- Publication number 20120223424
- Publication date Sep 6, 2012
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND M...
- Publication number 20100207277
- Publication date Aug 19, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC-THERMOSETTING COMPOSITE AND METHOD FOR BONDING A THER...
- Publication number 20090280314
- Publication date Nov 12, 2009
- Joachim Mahler
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device with semiconductor chip and method for produci...
- Publication number 20090039484
- Publication date Feb 12, 2009
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING...
- Publication number 20090026558
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER
- Publication number 20080315438
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STAC...
- Publication number 20080303172
- Publication date Dec 11, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Structure for a Semiconductor Component and Method for Produci...
- Publication number 20080224301
- Publication date Sep 18, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Component With a Cavity Housing and a Sensor Chip and Method...
- Publication number 20080173097
- Publication date Jul 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT
- Publication number 20080173998
- Publication date Jul 24, 2008
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH AT LEAST TWO SUBSTRATES
- Publication number 20080122075
- Publication date May 29, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component arrangement comprising a carrier
- Publication number 20080111216
- Publication date May 15, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Arrangement, System Carrier and Methods for Producing Same
- Publication number 20070278637
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module with a Semiconductor Chip and a Component Housing...
- Publication number 20070268674
- Publication date Nov 22, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...
- Publication number 20070235865
- Publication date Oct 11, 2007
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Comprising A Metal Coating Structure And Associa...
- Publication number 20070228567
- Publication date Oct 4, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with Strip Conductors and Production of Strip Conductors...
- Publication number 20070210883
- Publication date Sep 13, 2007
- Infineon Technologies AG
- Gottfried Beer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layer Between Interfaces of Different Components in Semiconductor D...
- Publication number 20070205518
- Publication date Sep 6, 2007
- Infineon Technologies AG
- Michael Bauer
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR COMPONENT COMPRISING FLIP CHIP CONTACTS AND METHOD FO...
- Publication number 20070182021
- Publication date Aug 9, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component including semiconductor chip and method for...
- Publication number 20070145552
- Publication date Jun 28, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device in lead frame technology with a vertical...
- Publication number 20070085201
- Publication date Apr 19, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic housing composition for embedding semicondutor devices in a...
- Publication number 20070054530
- Publication date Mar 8, 2007
- Michael Bauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device with conductor tracks between semiconductor ch...
- Publication number 20070034997
- Publication date Feb 15, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor sensor component including a sensor chip and methods...
- Publication number 20060273420
- Publication date Dec 7, 2006
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Alfred Haimerl

Person

Patents Grantslast 30 patents

Smart card module, smart card, and method for producing a smart car...

Chip packages, chip arrangements, a circuit board, and methods for...

Chip packages, chip arrangements, a circuit board, and methods for...

Chip arrangement and method for producing a chip arrangement

Chip arrangement and method for producing a chip arrangement

Thermoplastic-thermosetting composite and method for bonding a ther...

Semiconductor component and production method

Semiconductor component having a stack of semiconductor chips and m...

Semiconductor component and production method

Chip arrangement and method for producing a chip arrangement

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting eleme...

Component arrangement comprising a carrier

Semiconductor chip comprising a metal coating structure and associa...

Layer between interfaces of different components in semiconductor d...

Method of producing an electronic component with flexible bonding

Semiconductor module having discrete components and method for prod...

Semiconductor component including semiconductor chip and method for...

Semiconductor device having a sensor chip, and method for producing...

Plastic housing composition for embedding semiconductor devices in...

Electronic module with a semiconductor chip and a component housing...

Semiconductor device with semiconductor chip and method for produci...

Method of joining a thermoplastic material to a thermoset material,...

Semiconductor sensor component including a sensor chip and methods...

Semiconductor device including a stress buffer

Lead structure for a semiconductor component and method for produci...

Semiconductor substrate with strip conductors formed of carbon nano...

Sensor component with a cavity housing and a sensor chip and method...

Semiconductor component comprising flip chip contacts with polymer...

Semiconductor device with conductor tracks between semiconductor ch...

Patents Applicationslast 30 patents

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

SMART CARD MODULE, SMART CARD, AND METHOD FOR PRODUCING A SMART CAR...

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR...

CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT

CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT

SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD

SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND M...

THERMOPLASTIC-THERMOSETTING COMPOSITE AND METHOD FOR BONDING A THER...

Semiconductor device with semiconductor chip and method for produci...

SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING...

SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STAC...

Lead Structure for a Semiconductor Component and Method for Produci...

Sensor Component With a Cavity Housing and a Sensor Chip and Method...

CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT

SEMICONDUCTOR MODULE WITH AT LEAST TWO SUBSTRATES

Component arrangement comprising a carrier

Circuit Arrangement, System Carrier and Methods for Producing Same

Electronic Module with a Semiconductor Chip and a Component Housing...

SEMICONDUCTOR MODULE HAVINGDISCRETE COMPONENTS AND METHOD FOR PRODU...

Semiconductor Chip Comprising A Metal Coating Structure And Associa...

Substrate with Strip Conductors and Production of Strip Conductors...

Layer Between Interfaces of Different Components in Semiconductor D...

SEMICONDUCTOR COMPONENT COMPRISING FLIP CHIP CONTACTS AND METHOD FO...

Semiconductor component including semiconductor chip and method for...

Power semiconductor device in lead frame technology with a vertical...

Plastic housing composition for embedding semicondutor devices in a...

Semiconductor device with conductor tracks between semiconductor ch...

Semiconductor sensor component including a sensor chip and methods...