Alfred J. Griffin JR.

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a metal extrusion free via
- Patent number 6,617,231
- Issue date Sep 9, 2003
- Texas Instruments Incorporated
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT
- Publication number 20080207006
- Publication date Aug 28, 2008
- James Scott Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for removing wafer edge residue and debris usin...
- Publication number 20060266383
- Publication date Nov 30, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Joe G. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for removing wafer edge residue and debris usin...
- Publication number 20060270231
- Publication date Nov 30, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Joe G. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simultaneous deposition and etch process for barrier layer formatio...
- Publication number 20060258142
- Publication date Nov 16, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Asad M. Haider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method to form improved seed layer
- Publication number 20060014378
- Publication date Jan 19, 2006
- Sanjeev Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel barrier integration scheme for high-reliability vias
- Publication number 20060009030
- Publication date Jan 12, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a void free via
- Publication number 20050146035
- Publication date Jul 7, 2005
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a void free via
- Publication number 20040178504
- Publication date Sep 16, 2004
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a metal extrusion free via
- Publication number 20030190801
- Publication date Oct 9, 2003
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL EXTRUSION FREE VIA
- Publication number 20030170975
- Publication date Sep 11, 2003
- Alfred J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HDP liner layer prior to HSQ/SOG deposition to reduce the amount of...
- Publication number 20020013044
- Publication date Jan 31, 2002
- Rafael A. Mena
- H01 - BASIC ELECTRIC ELEMENTS

Alfred J. Griffin JR.

Person

Patents Grantslast 30 patents

Method for forming a metal extrusion free via

Patents Applicationslast 30 patents

PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT

Systems and methods for removing wafer edge residue and debris usin...

Systems and methods for removing wafer edge residue and debris usin...

Simultaneous deposition and etch process for barrier layer formatio...

System and method to form improved seed layer

Novel barrier integration scheme for high-reliability vias

Method for forming a void free via

Method for forming a void free via

Method for forming a metal extrusion free via

METHOD FOR FORMING A METAL EXTRUSION FREE VIA

HDP liner layer prior to HSQ/SOG deposition to reduce the amount of...