Alfred Kemper

Person

Warstein, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing an electronic device
- Patent number 8,698,053
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for producing a bondable area region on a carrier
- Patent number 8,167,187
- Issue date May 1, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Grant
Power semiconductor module and method for producing the same
- Patent number 7,986,034
- Issue date Jul 26, 2011
- Infineon Technologies, AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for connecting a component with a substrate
- Patent number 7,793,819
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the structured application of a laminatable film to a su...
- Patent number 7,742,843
- Issue date Jun 22, 2010
- Infineon Technologies AG
- Thomas Licht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip attachment
- Patent number 7,555,832
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for connecting components
- Patent number 7,525,187
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with ceramic substrate
- Patent number 6,828,600
- Issue date Dec 7, 2004
- eupec Europaeische Gesellschaft fuer Leistungshalbleiter mbH
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a soldered joint
- Patent number 6,796,483
- Issue date Sep 28, 2004
- Pink GmbH Vakuumtechnik
- Stefan Weber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Connecting a Component With a Substrate
- Publication number 20110017803
- Publication date Jan 27, 2011
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE
- Publication number 20080230589
- Publication date Sep 25, 2008
- Karsten Guth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Attachment
- Publication number 20080229575
- Publication date Sep 25, 2008
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Producing the Same
- Publication number 20080211091
- Publication date Sep 4, 2008
- INFINEON TECHNOLOGIES AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for connecting components
- Publication number 20080096311
- Publication date Apr 24, 2008
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC DEVICE
- Publication number 20080023530
- Publication date Jan 31, 2008
- INFINEON TECHNOLOGIES AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the structured application of a laminatable film to a su...
- Publication number 20070111475
- Publication date May 17, 2007
- Thomas Licht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for producing a bondable area region on a carrier
- Publication number 20060261133
- Publication date Nov 23, 2006
- eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
- Reinhold Bayerer
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for controlling and monitoring a brazing process
- Publication number 20060076389
- Publication date Apr 13, 2006
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor module with ceramic substrate
- Publication number 20030168724
- Publication date Sep 11, 2003
- Siemens AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS

Alfred Kemper

Person

Patents Grantslast 30 patents

Method for producing an electronic device

Method and device for producing a bondable area region on a carrier

Power semiconductor module and method for producing the same

Apparatus and method for connecting a component with a substrate

Method for the structured application of a laminatable film to a su...

Semiconductor chip attachment

Apparatus and method for connecting components

Power semiconductor module with ceramic substrate

Method and device for producing a soldered joint

Patents Applicationslast 30 patents

Method for Connecting a Component With a Substrate

APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE

Semiconductor Chip Attachment

Power Semiconductor Module and Method for Producing the Same

Apparatus and method for connecting components

METHOD FOR PRODUCING AN ELECTRONIC DEVICE

Method for the structured application of a laminatable film to a su...

Method and device for producing a bondable area region on a carrier

Method and apparatus for controlling and monitoring a brazing process

Power semiconductor module with ceramic substrate