Alfred Kersch

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Munich, DE

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for processing a substrate wafer and method for operating...
- Patent number 5,998,767
- Issue date Dec 7, 1999
- Siemens Aktiengesellschaft
- Alfred Kersch
- G01 - MEASURING TESTING
Information Patent Grant
Method for depositing a layer on a substrate wafer with a sputterin...
- Patent number 5,505,833
- Issue date Apr 9, 1996
- Siemens Aktiengesellschaft AG
- Christoph Werner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...