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Sealing of plate structures
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Patent number 6,416,375
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Issue date Jul 9, 2002
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Candescent Technologies Corporation
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Steven T. Cho
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H01 - BASIC ELECTRIC ELEMENTS
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Upgradable multi-chip module
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Patent number 5,648,893
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Issue date Jul 15, 1997
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Sun Microsystems, Inc.
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Mike C. Loo
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H01 - BASIC ELECTRIC ELEMENTS
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Upgradable multi-chip module
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Patent number 5,648,890
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Issue date Jul 15, 1997
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Sun Microsystems, Inc.
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Mike C. Loo
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H01 - BASIC ELECTRIC ELEMENTS
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