Alfred Sigl

Person

Sinzing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a bonded substrate stack by surface activation
- Patent number 11,948,912
- Issue date Apr 2, 2024
- Infineon Technologies AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonded substrate stack
- Patent number 11,594,515
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing thin-film layers and microsystems having thin...
- Patent number 11,414,320
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Alfred Sigl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for producing thin-film layers and microsystems having thin...
- Patent number 10,889,492
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Alfred Sigl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer
- Patent number 10,626,007
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temporary mechanical stabilization of semiconductor cavities
- Patent number 9,988,262
- Issue date Jun 5, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
- Publication number 20240274573
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
- Publication number 20230178512
- Publication date Jun 8, 2023
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK
- Publication number 20220139870
- Publication date May 5, 2022
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...
- Publication number 20210391377
- Publication date Dec 16, 2021
- Alexander Frey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Producing Thin-Film Layers and Microsystems Having Thin...
- Publication number 20210017019
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Alfred Sigl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR DEBONDING A STRUCTURE FROM A MAIN SURFACE REG...
- Publication number 20200023630
- Publication date Jan 23, 2020
- INFINEON TECHNOLOGIES AG
- Alfred Sigl
- B32 - LAYERED PRODUCTS
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER
- Publication number 20190367355
- Publication date Dec 5, 2019
- INFINEON TECHNOLOGIES AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PRODUCING THIN-FILM LAYERS AND MICROSYSTEMS HAVING THIN...
- Publication number 20190241431
- Publication date Aug 8, 2019
- INFINEON TECHNOLOGIES AG
- Alfred Sigl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER
- Publication number 20190016588
- Publication date Jan 17, 2019
- INFINEON TECHNOLOGIES AG
- Christian Bretthauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES
- Publication number 20180086632
- Publication date Mar 29, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Alfred Sigl

Person

Patents Grantslast 30 patents

Method of manufacturing a bonded substrate stack by surface activation

Method of manufacturing a bonded substrate stack

Methods for producing thin-film layers and microsystems having thin...

Methods for producing thin-film layers and microsystems having thin...

Microelectromechanical transducer

Temporary mechanical stabilization of semiconductor cavities

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION

METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION

METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...

Methods for Producing Thin-Film Layers and Microsystems Having Thin...

DEVICE AND METHOD FOR DEBONDING A STRUCTURE FROM A MAIN SURFACE REG...

MICROELECTROMECHANICAL TRANSDUCER

METHODS FOR PRODUCING THIN-FILM LAYERS AND MICROSYSTEMS HAVING THIN...

MICROELECTROMECHANICAL TRANSDUCER

TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES