Alfred Vater

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a non volatile memory device using wet etching
- Patent number 9,418,864
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,230,885
- Issue date Jan 5, 2016
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and a method of dicing a wafer
- Patent number 9,041,162
- Issue date May 26, 2015
- Infineon Technologies AG
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Protection layers for conductive pads and methods of formation thereof
- Patent number 8,835,319
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and a method of dicing a wafer
- Patent number 8,680,653
- Issue date Mar 25, 2014
- Infineon Technologies AG
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,580,687
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Gerald Dallmann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Manufacturing the Semiconductor...
- Publication number 20180047582
- Publication date Feb 15, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Marko Lemke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20150147839
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Alessia Scire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20140319688
- Publication date Oct 30, 2014
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer and a Method of Dicing a Wafer
- Publication number 20140167226
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Giuseppe Miccoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20140077379
- Publication date Mar 20, 2014
- Meinhold DIRK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20130228929
- Publication date Sep 5, 2013
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120080795
- Publication date Apr 5, 2012
- Gerald DALLMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Non Volatile Memory Device
- Publication number 20090189280
- Publication date Jul 30, 2009
- Daniel Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer and a Method of Dicing a Wafer
- Publication number 20090121321
- Publication date May 14, 2009
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Alfred Vater

Person

Patents Grantslast 30 patents

Method of forming a non volatile memory device using wet etching

Semiconductor structure and method for making same

Wafer and a method of dicing a wafer

Protection layers for conductive pads and methods of formation thereof

Wafer and a method of dicing a wafer

Semiconductor structure and method for making same

Patents Applicationslast 30 patents

Semiconductor Device and Method of Manufacturing the Semiconductor...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Protection Layers for Conductive Pads and Methods of Formation Thereof

Wafer and a Method of Dicing a Wafer

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Protection Layers for Conductive Pads and Methods of Formation Thereof

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Method of Forming a Non Volatile Memory Device

Wafer and a Method of Dicing a Wafer