Ali A. Farvid

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Palo Alto, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
Method for Plating Fine Grain Copper Deposit on Metal Substrate
- Publication number 20150197870
- Publication date Jul 16, 2015
- Ali A. Farvid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR