Ali N. Ergun

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency transmission line structures for wireless circuitry...
- Patent number 12,021,290
- Issue date Jun 25, 2024
- Apple Inc.
- Alireza Pourghorban Saghati
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transmission line, circuitry and system across multiple printed cir...
- Patent number 11,831,061
- Issue date Nov 28, 2023
- Apple Inc.
- Alireza Pourghorban Saghati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Identification of cushioning members in personal audio devices
- Patent number 11,689,842
- Issue date Jun 27, 2023
- Apple Inc.
- Jeffrey J. Terlizzi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Identification of cushioning members in personal audio devices
- Patent number 11,240,585
- Issue date Feb 1, 2022
- Apple Inc.
- Jeffrey J. Terlizzi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic latching of hinged devices
- Patent number 11,115,746
- Issue date Sep 7, 2021
- Apple Inc.
- Scott D. Morrison
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
- Publication number 20240107249
- Publication date Mar 28, 2024
- Apple Inc.
- Kyusang KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC CIRCUIT PACKAGES
- Publication number 20240080970
- Publication date Mar 7, 2024
- Apple Inc.
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPEAKER AND MICROPHONE FOR ACOUSTIC DEVICES
- Publication number 20230379609
- Publication date Nov 23, 2023
- Apple Inc.
- Scott C. GRINKER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES
- Publication number 20230078536
- Publication date Mar 16, 2023
- Apple Inc.
- Ali N. Ergun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Connections and Button Interconnects for Molded SiPs
- Publication number 20230056922
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Right Angle Sidewall and Button Interconnects for Molded SiPs
- Publication number 20230055647
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio-Frequency Transmission Line Structures Across Printed Circuits
- Publication number 20230028370
- Publication date Jan 26, 2023
- Apple Inc.
- Alireza Pourghorban Saghati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio-Frequency Transmission Line Structures Across Printed Circuits
- Publication number 20230022471
- Publication date Jan 26, 2023
- Apple Inc.
- Alireza Pourghorban Saghati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION OF CUSHIONING MEMBERS IN PERSONAL AUDIO DEVICES
- Publication number 20220116697
- Publication date Apr 14, 2022
- Apple Inc.
- Jeffrey J. Terlizzi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IDENTIFICATION OF CUSHIONING MEMBERS IN PERSONAL AUDIO DEVICES
- Publication number 20210084402
- Publication date Mar 18, 2021
- Apple Inc.
- Jeffrey J. Terlizzi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Ali N. Ergun

Person

Patents Grantslast 30 patents

Sidewall connections and button interconnects for molded SiPs

Radio-frequency transmission line structures for wireless circuitry...

Transmission line, circuitry and system across multiple printed cir...

Right angle sidewall and button interconnects for molded SiPs

Identification of cushioning members in personal audio devices

Identification of cushioning members in personal audio devices

Dynamic latching of hinged devices

Patents Applicationslast 30 patents

MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY

ELECTRONIC CIRCUIT PACKAGES

SPEAKER AND MICROPHONE FOR ACOUSTIC DEVICES

CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES

Sidewall Connections and Button Interconnects for Molded SiPs

Right Angle Sidewall and Button Interconnects for Molded SiPs

Radio-Frequency Transmission Line Structures Across Printed Circuits

Radio-Frequency Transmission Line Structures Across Printed Circuits

IDENTIFICATION OF CUSHIONING MEMBERS IN PERSONAL AUDIO DEVICES

IDENTIFICATION OF CUSHIONING MEMBERS IN PERSONAL AUDIO DEVICES