Ali Salem

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Mission Viejo, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die with reduced bump-to-pad ratio
- Patent number 7,663,235
- Issue date Feb 16, 2010
- Broadcom Corporation
- Fang Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor die with reduced bump-to-pad ratio
- Publication number 20080122080
- Publication date May 29, 2008
- Fang Lu
- H01 - BASIC ELECTRIC ELEMENTS