Ali Sengül

Person

Zurich, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Detection of force applied by pick-up tool for transferring semicon...
- Patent number 11,756,810
- Issue date Sep 12, 2023
- Meta Platforms Technologies, LLC
- Oscar Torrents Abad
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge pick-up head for transferring semiconductor devices
- Patent number 11,670,531
- Issue date Jun 6, 2023
- Meta Platforms Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with nanotube fitting
- Patent number 11,417,792
- Issue date Aug 16, 2022
- Meta Platforms Technologies, LLC
- Ali Sengül
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect using conductive adhesive
- Patent number 11,349,053
- Issue date May 31, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystalline elastomer for pick and place of semiconductor de...
- Patent number 11,328,942
- Issue date May 10, 2022
- Facebook Technologies, LLC
- Thomas John Farrell Wallin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic clamping interconnects
- Patent number 11,296,268
- Issue date Apr 5, 2022
- Facebook Technologies, LLC
- Ali Sengül
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding dummy electrodes of light emitting diode chip to substrate
- Patent number 11,276,672
- Issue date Mar 15, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding corners of light emitting diode chip to substrate using laser
- Patent number 11,255,529
- Issue date Feb 22, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic pick-up head for assembling light emitting diodes
- Patent number 11,107,948
- Issue date Aug 31, 2021
- Facebook Technologies, LLC
- Yigit Menguc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup head with photocurable polymers for assembling light emittin...
- Patent number 11,101,159
- Issue date Aug 24, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic force microscopy tips for interconnection
- Patent number 10,989,735
- Issue date Apr 27, 2021
- Facebook Technologies, LLC
- Ali Sengül
- G01 - MEASURING TESTING
Information Patent Grant
Rigid pickup head with conformable layer
- Patent number 10,818,643
- Issue date Oct 27, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
MICRO-DISPLAY PANEL FOR NEAR-EYE DISPLAY
- Publication number 20240136339
- Publication date Apr 25, 2024
- Meta Platforms Technologies, LLC
- Shenghui LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20220393060
- Publication date Dec 8, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20220352412
- Publication date Nov 3, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION
- Publication number 20210055327
- Publication date Feb 25, 2021
- Facebook Technologies, LLC
- Ali Sengül
- G01 - MEASURING TESTING
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...
- Publication number 20200395504
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20200395503
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Application
BRIDGE PICK-UP HEAD FOR TRANSFERRING SEMICONDUCTOR DEVICES
- Publication number 20200343121
- Publication date Oct 29, 2020
- Facebook Technologies, LLC
- Oscar Torrents Abad
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Ali Sengül

Person

Patents Grantslast 30 patents

Detection of force applied by pick-up tool for transferring semicon...

Dielectric-dielectric and metallization bonding via plasma activati...

Bridge pick-up head for transferring semiconductor devices

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Hybrid interconnect for laser bonding using nanoporous metal tips

Interconnect with nanotube fitting

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Flexible interconnect using conductive adhesive

Liquid crystalline elastomer for pick and place of semiconductor de...

Magnetic clamping interconnects

Bonding dummy electrodes of light emitting diode chip to substrate

Bonding corners of light emitting diode chip to substrate using laser

Curved pillar interconnects

Fluidic pick-up head for assembling light emitting diodes

Pickup head with photocurable polymers for assembling light emittin...

Atomic force microscopy tips for interconnection

Rigid pickup head with conformable layer

Patents Applicationslast 30 patents

MICRO-DISPLAY PANEL FOR NEAR-EYE DISPLAY

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

BRIDGE PICK-UP HEAD FOR TRANSFERRING SEMICONDUCTOR DEVICES