Alice Tseng

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Leaded semiconductor device package for use in nonsoldering assembling
- Patent number 6,395,982
- Issue date May 28, 2002
- William John Nelson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADED SEMICONDUCTOR DEVICE PACKAGE FOR USE IN NONSOLDERING ASSEMBLING
- Publication number 20010013421
- Publication date Aug 16, 2001
- WILLIAM JOHN NELSON
- H01 - BASIC ELECTRIC ELEMENTS