Allan Lin

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Hsin Chu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Heat spreader and package structure utilizing the same
- Patent number 7,378,731
- Issue date May 27, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and package structure utilizing the same
- Patent number 7,190,066
- Issue date Mar 13, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat spreader and package structure utilizing the same
- Publication number 20070138627
- Publication date Jun 21, 2007
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and package structure utilizing the same
- Publication number 20060202326
- Publication date Sep 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional package and packaging method for integrated circuits
- Publication number 20060065958
- Publication date Mar 30, 2006
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS