Allen B. Gardiner

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,991,873
- Issue date May 21, 2024
- Intel Corporation
- Travis W. Lajoie
Information Patent Grant
Capacitor connections in dielectric layers
- Patent number 11,832,438
- Issue date Nov 28, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,758,711
- Issue date Sep 12, 2023
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate separation layers at the back-end-of-line
- Patent number 11,652,047
- Issue date May 16, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor separations in dielectric layers
- Patent number 11,610,894
- Issue date Mar 21, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of contact patterning of thin film transistors for embedded...
- Patent number 11,563,107
- Issue date Jan 24, 2023
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor structures with gas spacer
- Patent number 11,404,536
- Issue date Aug 2, 2022
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,329,047
- Issue date May 10, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 11,121,073
- Issue date Sep 14, 2021
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate patterning for multi-gate transistors
- Patent number 7,666,796
- Issue date Feb 23, 2010
- Intel Corporation
- Ibrahim Ban
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED...
- Publication number 20240154037
- Publication date May 9, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURE AND GATE METAL STRUCTURES WITH A PLANAR TOP SUR...
- Publication number 20240113116
- Publication date Apr 4, 2024
- Intel Corporation
- Dan S. LAVRIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY...
- Publication number 20240105804
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20240049450
- Publication date Feb 8, 2024
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SIDEWALL FEATURES FOR TUNING THIN FILM TRANSISTOR (TFT)...
- Publication number 20230369501
- Publication date Nov 16, 2023
- Intel Corporation
- Cheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN I...
- Publication number 20230317731
- Publication date Oct 5, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE GATE TIE-DOWN
- Publication number 20230317787
- Publication date Oct 5, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT STRUCTURES FORMED BEFORE DUMMY GATE
- Publication number 20230282483
- Publication date Sep 7, 2023
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH SELF-ALIGNED TUB ARCHITECTURE
- Publication number 20230207704
- Publication date Jun 29, 2023
- Dan S. LAVRIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20230200043
- Publication date Jun 22, 2023
- Intel Corporation
- Travis W. LAJOIE
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED...
- Publication number 20230197854
- Publication date Jun 22, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT OFFSET
- Publication number 20230187444
- Publication date Jun 15, 2023
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20220320275
- Publication date Oct 6, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...
- Publication number 20220208770
- Publication date Jun 30, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20210366821
- Publication date Nov 25, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS
- Publication number 20210125992
- Publication date Apr 29, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...
- Publication number 20210098373
- Publication date Apr 1, 2021
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS
- Publication number 20200411520
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE
- Publication number 20200411426
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS
- Publication number 20200411635
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS
- Publication number 20200411525
- Publication date Dec 31, 2020
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTACT PATTERNING OF THIN FILM TRANSISTORS FOR EMBEDDED...
- Publication number 20200303520
- Publication date Sep 24, 2020
- Intel Corporation
- Chieh-Jen KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...
- Publication number 20190326296
- Publication date Oct 24, 2019
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20190305081
- Publication date Oct 3, 2019
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20190304897
- Publication date Oct 3, 2019
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate patterning for multi-gate transistors
- Publication number 20070224815
- Publication date Sep 27, 2007
- Ibrahim Ban
- H01 - BASIC ELECTRIC ELEMENTS

Allen B. Gardiner

Person

Patents Grantslast 30 patents

Through plate interconnect for a vertical MIM capacitor

Integrated circuit structures having differentiated interconnect li...

Capacitor separations in dielectric layers

Capacitor connections in dielectric layers

Thin-film transistor embedded dynamic random-access memory with sha...

Intermediate separation layers at the back-end-of-line

Capacitor separations in dielectric layers

Method of contact patterning of thin film transistors for embedded...

Thin-film transistor structures with gas spacer

Thin-film transistor embedded dynamic random-access memory with sha...

Through plate interconnect for a vertical MIM capacitor

Substrate patterning for multi-gate transistors

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED...

EPITAXIAL STRUCTURE AND GATE METAL STRUCTURES WITH A PLANAR TOP SUR...

INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY...

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

DIELECTRIC SIDEWALL FEATURES FOR TUNING THIN FILM TRANSISTOR (TFT)...

INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN I...

INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE GATE TIE-DOWN

GATE CUT STRUCTURES FORMED BEFORE DUMMY GATE

INTEGRATED CIRCUITS WITH SELF-ALIGNED TUB ARCHITECTURE

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED...

INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT OFFSET

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...

CAPACITOR SEPARATIONS IN DIELECTRIC LAYERS

INTERMEDIATE SEPARATION LAYERS AT THE BACK-END-OF-LINE

AIR GAPS AND CAPACITORS IN DIELECTRIC LAYERS

CAPACITOR CONNECTIONS IN DIELECTRIC LAYERS

METHOD OF CONTACT PATTERNING OF THIN FILM TRANSISTORS FOR EMBEDDED...

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

Substrate patterning for multi-gate transistors