Allis Chen

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure for a photosensitive chip
- Patent number 6,590,269
- Issue date Jul 8, 2003
- Kingpak Technology Inc.
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module card and a method for manufacturing the same
- Patent number 6,565,008
- Issue date May 20, 2003
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having central leads and method for...
- Patent number 6,501,187
- Issue date Dec 31, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an integrated circuit package and method fo...
- Patent number 6,489,572
- Issue date Dec 3, 2002
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Jig structure for an integrated circuit package
- Publication number 20030118680
- Publication date Jun 26, 2003
- Chief Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20030071129
- Publication date Apr 17, 2003
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...
- Publication number 20020096360
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits
- Publication number 20020096754
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of integrated circuits and method for packaging t...
- Publication number 20020096766
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit structure having an adhesive agent and method fo...
- Publication number 20020096751
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure for a photosensitive chip

Module card and a method for manufacturing the same

Semiconductor package structure having central leads and method for...

Substrate structure for an integrated circuit package and method fo...

Patents Applicationslast 30 patents

Jig structure for an integrated circuit package

Image sensor structure

MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME

SUBSTRATE STRUCTURE FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD FO...

Stacked structure of integrated circuits

Structure of stacked integrated circuits and method for manufacturi...

Package structure of integrated circuits and method for packaging t...

Integrated circuit structure having an adhesive agent and method fo...

STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...