Alois Stelzl

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electric component with sensitive component structures and method f...
- Patent number 11,245,977
- Issue date Feb 8, 2022
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 10,164,166
- Issue date Dec 25, 2018
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 9,853,204
- Issue date Dec 26, 2017
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package and method for production thereof
- Patent number 9,647,196
- Issue date May 9, 2017
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component and method for producing a component
- Patent number 9,382,110
- Issue date Jul 5, 2016
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for connecting a plurality of unpackaged substrates
- Patent number 9,165,905
- Issue date Oct 20, 2015
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for producing chip devices, and chip device pr...
- Patent number 9,114,979
- Issue date Aug 25, 2015
- EPCOS AG
- Michael Gerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of an MEMS component and a method for producing said...
- Patent number 9,006,868
- Issue date Apr 14, 2015
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method for producing the MEMS microphone
- Patent number 8,865,499
- Issue date Oct 21, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed housing for electronic components and manufactu...
- Patent number 8,759,677
- Issue date Jun 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Element with optical marking, manufacturing method, and use
- Patent number 8,691,369
- Issue date Apr 8, 2014
- EPCOS AG
- Alexander Schmajew
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor chip arrangement with sensor chip and manufacturing m...
- Patent number 8,580,613
- Issue date Nov 12, 2013
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,432,007
- Issue date Apr 30, 2013
- EPCOS AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a MEMS package
- Patent number 8,404,516
- Issue date Mar 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical component and production method
- Patent number 8,294,535
- Issue date Oct 23, 2012
- EPCOS AG
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,169,041
- Issue date May 1, 2012
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for production
- Patent number 8,110,962
- Issue date Feb 7, 2012
- EPCOS AG
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip-chip component production method
- Patent number 7,673,386
- Issue date Mar 9, 2010
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement provided with a carrier substrate
- Patent number 7,608,789
- Issue date Oct 27, 2009
- EPCOS AG
- Hans Krüger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for hermetically encapsulating a component
- Patent number 7,552,532
- Issue date Jun 30, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electrical component and production method
- Patent number 7,544,540
- Issue date Jun 9, 2009
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for encapsulating an electrical component, and surface acous...
- Patent number 7,518,201
- Issue date Apr 14, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic component and production method
- Patent number 7,388,281
- Issue date Jun 17, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the hermetic encapsulation of a component
- Patent number 7,259,041
- Issue date Aug 21, 2007
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating an electrical component
- Patent number 7,094,626
- Issue date Aug 22, 2006
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for an electric component and method for the production t...
- Patent number 6,909,183
- Issue date Jun 21, 2005
- EPCOS AG
- Gregor Feiertag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component with a label
- Patent number 6,838,739
- Issue date Jan 4, 2005
- Epcos AG
- Alois Stelzl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for manufacturing an electronic component, in particular a...
- Patent number 6,722,030
- Issue date Apr 20, 2004
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave component
- Patent number 6,685,168
- Issue date Feb 3, 2004
- Epcos Aktiengesellschaft
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple blank for electronic components such as SAW components, an...
- Patent number 6,555,758
- Issue date Apr 29, 2003
- EPCOS AG
- Alois Stelzl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS
- Publication number 20180097172
- Publication date Apr 5, 2018
- SnapTrack, Inc.
- Hans KRÜGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...
- Publication number 20170272855
- Publication date Sep 21, 2017
- SnapTrack, Inc.
- Christian BAUER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Component and Method for Encapsulating MEMS Components
- Publication number 20150325780
- Publication date Nov 12, 2015
- EPCOS AG
- Hans Krüger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method for Producing a Component
- Publication number 20140226285
- Publication date Aug 14, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-Level Package and Method for Production Thereof
- Publication number 20140111062
- Publication date Apr 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...
- Publication number 20130341773
- Publication date Dec 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component and Method for Producing a Component
- Publication number 20130214405
- Publication date Aug 22, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone And Method For Producing The MEMS Microphone
- Publication number 20130140656
- Publication date Jun 6, 2013
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Connecting a Plurality of Unpackaged Substrates
- Publication number 20120159778
- Publication date Jun 28, 2012
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Producing Chip Devices, and Chip Device Pr...
- Publication number 20120061778
- Publication date Mar 15, 2012
- EPCOS AG
- Michael Gerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...
- Publication number 20110233690
- Publication date Sep 29, 2011
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Application
MEMS Package and Method for the Production Thereof
- Publication number 20110186943
- Publication date Aug 4, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...
- Publication number 20110114355
- Publication date May 19, 2011
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Component and Method for Production
- Publication number 20100148285
- Publication date Jun 17, 2010
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Producing a MEMS Package
- Publication number 20100127377
- Publication date May 27, 2010
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical component and production method
- Publication number 20090224851
- Publication date Sep 10, 2009
- EPCOS AG
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Element with Optical Marking, Manufacturing Method, and Use
- Publication number 20090104415
- Publication date Apr 23, 2009
- Alexander Schmajew
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Flip-Chip Component and Method for its Production
- Publication number 20090071710
- Publication date Mar 19, 2009
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mems Package and Method for the Production Thereof
- Publication number 20090001553
- Publication date Jan 1, 2009
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component Arrangement Provided With a Carrier Substrate
- Publication number 20080038577
- Publication date Feb 14, 2008
- EPCOS AG
- Hans Kruger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Electrical Component and Production Method
- Publication number 20070222056
- Publication date Sep 27, 2007
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for encapsulating an electrical component, and surface acous...
- Publication number 20060249802
- Publication date Nov 9, 2006
- EPCOS AG
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Encapsulated electronic component and production method
- Publication number 20060151203
- Publication date Jul 13, 2006
- Hans Krueger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for the hermetic encapsulation of a component
- Publication number 20050121785
- Publication date Jun 9, 2005
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for encapsulating an electrical component and surface wave c...
- Publication number 20040239449
- Publication date Dec 2, 2004
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for hermetically encapsulating a component
- Publication number 20040237299
- Publication date Dec 2, 2004
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for an electric component and method for the production t...
- Publication number 20040058473
- Publication date Mar 25, 2004
- Gregor Feiertag
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Component provided with a description
- Publication number 20030047806
- Publication date Mar 13, 2003
- Alois Stelzl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of producing a surface acoustic wave component
- Publication number 20010010444
- Publication date Aug 2, 2001
- Siemens Matsushita Components GmbH & Co. KG
- Wolfgang Pahl
- H03 - BASIC ELECTRONIC CIRCUITRY

Alois Stelzl

Person

Patents Grantslast 30 patents

Electric component with sensitive component structures and method f...

MEMS component and method for encapsulating MEMS components

MEMS component and method for encapsulating MEMS components

Wafer-level package and method for production thereof

Component and method for producing a component

Method for connecting a plurality of unpackaged substrates

Method and apparatus for producing chip devices, and chip device pr...

Encapsulation of an MEMS component and a method for producing said...

MEMS microphone and method for producing the MEMS microphone

Hermetically sealed housing for electronic components and manufactu...

Element with optical marking, manufacturing method, and use

Semiconductor chip arrangement with sensor chip and manufacturing m...

MEMS package and method for the production thereof

Method for producing a MEMS package

Electrical component and production method

MEMS package and method for the production thereof

MEMS component and method for production

Flip-chip component production method

Component arrangement provided with a carrier substrate

Method for hermetically encapsulating a component

Encapsulated electrical component and production method

Method for encapsulating an electrical component, and surface acous...

Encapsulated electronic component and production method

Method for the hermetic encapsulation of a component

Method for encapsulating an electrical component

Substrate for an electric component and method for the production t...

Component with a label

Process for manufacturing an electronic component, in particular a...

Surface acoustic wave component

Multiple blank for electronic components such as SAW components, an...

Patents Applicationslast 30 patents

MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS

SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...

MEMS Component and Method for Encapsulating MEMS Components

Component and Method for Producing a Component

Wafer-Level Package and Method for Production Thereof

ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...

Component and Method for Producing a Component

MEMS Microphone And Method For Producing The MEMS Microphone

Method for Connecting a Plurality of Unpackaged Substrates

Method and Apparatus for Producing Chip Devices, and Chip Device Pr...

SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...

MEMS Package and Method for the Production Thereof

HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...

MEMS Component and Method for Production

Method for Producing a MEMS Package

Electrical component and production method

Element with Optical Marking, Manufacturing Method, and Use

Flip-Chip Component and Method for its Production

Mems Package and Method for the Production Thereof

Component Arrangement Provided With a Carrier Substrate

Encapsulated Electrical Component and Production Method

Method for encapsulating an electrical component, and surface acous...

Encapsulated electronic component and production method

Method for the hermetic encapsulation of a component

Method for encapsulating an electrical component and surface wave c...

Method for hermetically encapsulating a component

Substrate for an electric component and method for the production t...

Component provided with a description

Method of producing a surface acoustic wave component