Amanda E. Schuckman

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic interconnect structures
- Patent number 12,062,551
- Issue date Aug 13, 2024
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic interconnect structures
- Patent number 11,631,595
- Issue date Apr 18, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic interconnect structures
- Patent number 11,195,727
- Issue date Dec 7, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including silane based adhesion promoter and m...
- Patent number 10,916,486
- Issue date Feb 9, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes void free holes
- Patent number 10,856,424
- Issue date Dec 1, 2020
- Intel Corporation
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High density organic interconnect structures
- Patent number 10,685,850
- Issue date Jun 16, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semiconductor packages using photoimageable...
- Patent number 10,553,453
- Issue date Feb 4, 2020
- Intel Corporation
- Sri Chaitra Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-zinc microbump structures and method of making same
- Patent number 10,373,900
- Issue date Aug 6, 2019
- Intel Corporation
- Sri Chaitra J. Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper seed layer and nickel-tin microbump structures
- Patent number 10,297,563
- Issue date May 21, 2019
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,103,103
- Issue date Oct 16, 2018
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal protected fan-out cavity
- Patent number 9,953,959
- Issue date Apr 24, 2018
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with bi-layered dielectric structure
- Patent number 9,917,044
- Issue date Mar 13, 2018
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-zinc microbump structures
- Patent number 9,837,341
- Issue date Dec 5, 2017
- Intel Corporation
- Sri Chaitra J. Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Desmear with metalized protective film
- Patent number 9,741,606
- Issue date Aug 22, 2017
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,640,485
- Issue date May 2, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,147,663
- Issue date Sep 29, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a void-free filled interconnect structure in a layer of p...
- Patent number 8,877,632
- Issue date Nov 4, 2014
- Intel Corporation
- Amanda E. Schuckman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20240014138
- Publication date Jan 11, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20220059367
- Publication date Feb 24, 2022
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20210384129
- Publication date Dec 9, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20200043852
- Publication date Feb 6, 2020
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20190355642
- Publication date Nov 21, 2019
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SEMICONDUCTOR PACKAGES USING PHOTOIMAGEABLE...
- Publication number 20190311916
- Publication date Oct 10, 2019
- Intel Corporation
- Sri Chaitra CHAVALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20190244922
- Publication date Aug 8, 2019
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
- Publication number 20190221447
- Publication date Jul 18, 2019
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20190013271
- Publication date Jan 10, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT THROUGH-HOLE INTERCONNECT STRUCTURES
- Publication number 20180323138
- Publication date Nov 8, 2018
- Intel Corporation
- Amanda E. SCHUCKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES
- Publication number 20180288885
- Publication date Oct 4, 2018
- Sri Ranga Sai Boyapati
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20180076161
- Publication date Mar 15, 2018
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-ZINC MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20180076119
- Publication date Mar 15, 2018
- Intel Corporation
- Sri Chaitra J. Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20170207168
- Publication date Jul 20, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS TOLERANT COMPOSITE MATERIAL AND ARCHITECTURE
- Publication number 20170174894
- Publication date Jun 22, 2017
- Sri Chaitra Chavali
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE WITH BI-LAYERED DIELECTRIC STRUCTURE
- Publication number 20170103941
- Publication date Apr 13, 2017
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESMEAR WITH METALIZED PROTECTIVE FILM
- Publication number 20170040211
- Publication date Feb 9, 2017
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20150364423
- Publication date Dec 17, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20140353827
- Publication date Dec 4, 2014
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING A VOID-FREE FILLED INTERCONNECT STRUCTURE IN A LAYER OF A...
- Publication number 20140332974
- Publication date Nov 13, 2014
- Amanda E. Schuckman
- H01 - BASIC ELECTRIC ELEMENTS

Amanda E. Schuckman

Person

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

High density organic interconnect structures

Bridge interconnection with layered interconnect structures

High density organic interconnect structures

High density organic interconnect structures

Bridge interconnection with layered interconnect structures

Semiconductor device including silane based adhesion promoter and m...

Electronic assembly that includes void free holes

High density organic interconnect structures

Systems and methods for semiconductor packages using photoimageable...

Bridge interconnection with layered interconnect structures

Tin-zinc microbump structures and method of making same

Copper seed layer and nickel-tin microbump structures

Bridge interconnection with layered interconnect structures

Metal protected fan-out cavity

Package with bi-layered dielectric structure

Tin-zinc microbump structures

Desmear with metalized protective film

Bridge interconnection with layered interconnect structures

Bridge interconnection with layered interconnect structures

Providing a void-free filled interconnect structure in a layer of p...

Patents Applicationslast 30 patents

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

SYSTEMS AND METHODS FOR SEMICONDUCTOR PACKAGES USING PHOTOIMAGEABLE...

NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME

HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

REDUNDANT THROUGH-HOLE INTERCONNECT STRUCTURES

ELECTRONIC ASSEMBLY THAT INCLUDES VOID FREE HOLES

NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME

TIN-ZINC MICROBUMP STRUCTURES AND METHOD OF MAKING SAME

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

STRESS TOLERANT COMPOSITE MATERIAL AND ARCHITECTURE

PACKAGE WITH BI-LAYERED DIELECTRIC STRUCTURE

DESMEAR WITH METALIZED PROTECTIVE FILM

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

PROVIDING A VOID-FREE FILLED INTERCONNECT STRUCTURE IN A LAYER OF A...