Amanda Elisa Ennis Mikhail

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Implementing differential signal circuit board electrical contact
- Patent number 8,007,291
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Don Alan Gilliland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,944,698
- Issue date May 17, 2011
- International Business Machines Corporation
- John Lee Colbert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrically connecting two substrates using a resilient wire bundl...
- Patent number 7,765,693
- Issue date Aug 3, 2010
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and method for compensating for differing coefficients of th...
- Patent number 7,632,127
- Issue date Dec 15, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,606,033
- Issue date Oct 20, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and method for compensating for differing coefficients of th...
- Patent number 7,530,853
- Issue date May 12, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite core, and flexible assembly of ferrite cores for suppressin...
- Patent number 7,489,224
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Jessica Rose Berens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting a heat sink in thermal contact with an electronic component
- Patent number 7,486,516
- Issue date Feb 3, 2009
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a socket that compensates for differing co...
- Patent number 7,472,477
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and method for compensating for differing coefficients of th...
- Patent number 7,303,443
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrically connecting two substrates usi...
- Patent number 7,293,994
- Issue date Nov 13, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite core, and flexible assembly of ferrite cores for suppressin...
- Patent number 7,138,896
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Jessica Rose Berens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
V-seal EMC gasket assembly for precise placement, conduction and re...
- Patent number 7,084,344
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Don Alan Gilliland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPENSATION OF THERMAL EXPANSION IN SMT INTERCONNECTS
- Publication number 20100184305
- Publication date Jul 22, 2010
- International Business Machines Corporation
- WILLIAM LOUIS BRODSKY
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrically Connecting Two Substrates Using a Resilient Wire Bundl...
- Publication number 20080282539
- Publication date Nov 20, 2008
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080264603
- Publication date Oct 30, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting a Heat Sink in Thermal Contact with an Electronic Component
- Publication number 20080259572
- Publication date Oct 23, 2008
- International Business Machines Corporation
- John Lee Colbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket and Method for Compensating for Differing Coefficients of Th...
- Publication number 20080182443
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket and method for compensating for differing coefficients of th...
- Publication number 20080090439
- Publication date Apr 17, 2008
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for electrically connecting two substrates usi...
- Publication number 20070134948
- Publication date Jun 14, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferrite core, and flexible assembly of ferrite cores for suppressin...
- Publication number 20070013470
- Publication date Jan 18, 2007
- International Business Machines Corporation
- Jessica Rose Berens
- H01 - BASIC ELECTRIC ELEMENTS

Amanda Elisa Ennis Mikhail

Person

Patents Grantslast 30 patents

Implementing differential signal circuit board electrical contact

Mounting a heat sink in thermal contact with an electronic component

Electrically connecting two substrates using a resilient wire bundl...

Socket and method for compensating for differing coefficients of th...

Mounting a heat sink in thermal contact with an electronic component

Socket and method for compensating for differing coefficients of th...

Ferrite core, and flexible assembly of ferrite cores for suppressin...

Mounting a heat sink in thermal contact with an electronic component

Method for manufacturing a socket that compensates for differing co...

Socket and method for compensating for differing coefficients of th...

Method and apparatus for electrically connecting two substrates usi...

Ferrite core, and flexible assembly of ferrite cores for suppressin...

V-seal EMC gasket assembly for precise placement, conduction and re...

Patents Applicationslast 30 patents

COMPENSATION OF THERMAL EXPANSION IN SMT INTERCONNECTS

Electrically Connecting Two Substrates Using a Resilient Wire Bundl...

Mounting a Heat Sink in Thermal Contact with an Electronic Component

Mounting a Heat Sink in Thermal Contact with an Electronic Component

Socket and Method for Compensating for Differing Coefficients of Th...

Socket and method for compensating for differing coefficients of th...

Method and apparatus for electrically connecting two substrates usi...

Ferrite core, and flexible assembly of ferrite cores for suppressin...