Amarjit S. Rai

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method of making same
- Patent number 6,426,565
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density printed wiring board possessing controlled coefficient...
- Patent number 6,323,436
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Jeffrey Curtis Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate and method of manufacture thereof
- Patent number 6,207,595
- Issue date Mar 27, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film composition and method for a planar surface atop a plated thro...
- Patent number 6,037,096
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Mary Beth Fletcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed circuit board having filled holes
- Patent number 6,009,620
- Issue date Jan 4, 2000
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS

Amarjit S. Rai

Person

Patents Grantslast 30 patents

Fabrication of a metalized blind via

Fabrication of a metalized blind via

Electronic package and method of making same

High density printed wiring board possessing controlled coefficient...

Laminate and method of manufacture thereof

Film composition and method for a planar surface atop a plated thro...

Method of making a printed circuit board having filled holes

Patents Applicationslast 30 patents

Fabrication of a metalized blind via