Ameet S. Bhansali

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding surface and bonding method
- Patent number 6,265,300
- Issue date Jul 24, 2001
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 substrate contact pad which has a layer of NI-B plating
- Patent number 5,893,725
- Issue date Apr 13, 1999
- Intel Corporation
- Ameet Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-ground plane for a C4 flip-chip substrate
- Patent number 5,886,406
- Issue date Mar 23, 1999
- Intel Corporation
- Ameet Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coupling surface mounted capacitors to semiconductor pac...
- Patent number 5,842,626
- Issue date Dec 1, 1998
- Intel Corporation
- Ameet S. Bhansali
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer C4 flip-chip substrate
- Patent number 5,786,630
- Issue date Jul 28, 1998
- Intel Corporation
- Ameet Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
C4 substrate contact pad which has a layer of Ni-B plating
- Patent number 5,757,071
- Issue date May 26, 1998
- Intel Corporation
- Ameet Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-ground plane for a C4 flip-chip substrate
- Patent number 5,708,296
- Issue date Jan 13, 1998
- Intel Corporation
- Ameet Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure having an interposed rigid layer
- Patent number 5,567,981
- Issue date Oct 22, 1996
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS

Ameet S. Bhansali

Person

Patents Grantslast 30 patents

Wire bonding surface and bonding method

C4 substrate contact pad which has a layer of NI-B plating

Power-ground plane for a C4 flip-chip substrate

Method for coupling surface mounted capacitors to semiconductor pac...

Multi-layer C4 flip-chip substrate

C4 substrate contact pad which has a layer of Ni-B plating

Power-ground plane for a C4 flip-chip substrate

Bonding pad structure having an interposed rigid layer