Aminuddin Ismail

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Selangor Darul Ehsan, MY

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Patents Grantslast 30 patents

Information Patent Grant
Heat spreader for center gate molding
- Patent number 8,643,172
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip and wire bond semiconductor package
- Patent number 7,554,185
- Issue date Jun 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die without lead frame or substrate
- Patent number 7,432,130
- Issue date Oct 7, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SPREADER FOR CENTER GATE MOLDING
- Publication number 20080305584
- Publication date Dec 11, 2008
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip And Wire Bond Semiconductor Package
- Publication number 20080111248
- Publication date May 15, 2008
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging method
- Publication number 20070202680
- Publication date Aug 30, 2007
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging semiconductor die
- Publication number 20070178626
- Publication date Aug 2, 2007
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a stacked die package
- Publication number 20070026573
- Publication date Feb 1, 2007
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die semiconductor device
- Publication number 20030160311
- Publication date Aug 28, 2003
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS