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Amir Wagiman
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Kedah, MY
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last 30 patents
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Patent Grant
Package-on-package assembly and method
Patent number
9,070,787
Issue date
Jun 30, 2015
Intel Corporation
Amir Wagiman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit package with surface mounted pins on an organic...
Patent number
6,413,849
Issue date
Jul 2, 2002
Intel Corporation
Hwai-Peng Yeoh
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD
Publication number
20140248741
Publication date
Sep 4, 2014
Amir Wagiman
H01 - BASIC ELECTRIC ELEMENTS