Amirul Afiq Hud

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with step cut lead
- Patent number 11,502,045
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Amirul Afiq bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,699,978
- Issue date Jun 30, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for multiphase circuitry device
- Patent number 10,147,703
- Issue date Dec 4, 2018
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat slug and rivet free die attach area
- Patent number 10,083,899
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising side wall marking
- Patent number 9,972,576
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH STEP CUT LEAD
- Publication number 20200235057
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Amirul Afiq bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080973
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE
- Publication number 20180277513
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA
- Publication number 20180211907
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
- Publication number 20170179009
- Publication date Jun 22, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package comprising side wall marking
- Publication number 20170148743
- Publication date May 25, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS

Amirul Afiq Hud

Person

Patents Grantslast 30 patents

Electronic device with step cut lead

SMD package with top side cooling

Semiconductor devices with improved thermal and electrical performance

Semiconductor chip package having a repeating footprint pattern

Semiconductor package for multiphase circuitry device

Semiconductor package with heat slug and rivet free die attach area

Semiconductor chip package comprising side wall marking

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH STEP CUT LEAD

SMD Package with Top Side Cooling

SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE

SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA

Semiconductor Chip Package Having a Repeating Footprint Pattern

SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

Semiconductor chip package comprising side wall marking