Amit Kelkar

Person

Flower Mound, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Warpage compensation metal for wafer level packaging technology
- Patent number 10,134,689
- Issue date Nov 20, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip-to-wafer integration
- Patent number 10,032,749
- Issue date Jul 24, 2018
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out and heterogeneous packaging of electronic components
- Patent number 9,704,809
- Issue date Jul 11, 2017
- Maxim Integrated Products, Inc.
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for wafer-level processing of QFN packages
- Patent number 9,472,451
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
- Patent number 9,331,048
- Issue date May 3, 2016
- Maxim Integrated Products, Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level passive device integration
- Patent number 9,324,687
- Issue date Apr 26, 2016
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package device having high-standoff peripheral solder b...
- Patent number 9,219,043
- Issue date Dec 22, 2015
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional chip-to-wafer integration
- Patent number 9,190,391
- Issue date Nov 17, 2015
- Maxim Integrated Products, Inc.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for varied topographic MEMS cap process
- Patent number 9,040,386
- Issue date May 26, 2015
- Maxim Integrated Products, Inc.
- Xuejun Ying
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level thin chip integration
- Patent number 9,000,587
- Issue date Apr 7, 2015
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
- Patent number 8,970,043
- Issue date Mar 3, 2015
- Maxim Integrated Products, Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a buffer material and stiffener
- Patent number 8,878,350
- Issue date Nov 4, 2014
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer-level processing of QFN packages
- Patent number 8,860,222
- Issue date Oct 14, 2014
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal processing of silicon wafers
- Patent number 8,124,916
- Issue date Feb 28, 2012
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- F27 - FURNACES KILNS OVENS RETORTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION
- Publication number 20160071826
- Publication date Mar 10, 2016
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
- Publication number 20150132891
- Publication date May 14, 2015
- Maxim Integrated Products, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20150028475
- Publication date Jan 29, 2015
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VARIED TOPOGRAPHIC MEMS CAP PROCESS
- Publication number 20150028455
- Publication date Jan 29, 2015
- Maxim Integrated Products, Inc.
- Xuejun Ying
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BUFFER MATERIAL AND STIFFENER
- Publication number 20140306337
- Publication date Oct 16, 2014
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...
- Publication number 20140264845
- Publication date Sep 18, 2014
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS
- Publication number 20140252655
- Publication date Sep 11, 2014
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20130161817
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION
- Publication number 20130105966
- Publication date May 2, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
- Publication number 20120193808
- Publication date Aug 2, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PREVENTING CONTACT STICTION IN MICRO RELAYS
- Publication number 20120194306
- Publication date Aug 2, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Uppili Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Processing of Silicon Wafers
- Publication number 20080254599
- Publication date Oct 16, 2008
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced Leakage within a Semiconductor Device
- Publication number 20080150092
- Publication date Jun 26, 2008
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce semiconductor device leakage
- Publication number 20080135988
- Publication date Jun 12, 2008
- Maxim Integrated Products, Inc.
- Amit Subhash Kelkar
- H01 - BASIC ELECTRIC ELEMENTS

Amit Kelkar

Person

Patents Grantslast 30 patents

Warpage compensation metal for wafer level packaging technology

Three-dimensional chip-to-wafer integration

Fan-out and heterogeneous packaging of electronic components

Technique for wafer-level processing of QFN packages

Bonded stacked wafers and methods of electroplating bonded stacked...

Wafer-level passive device integration

Wafer-level package device having high-standoff peripheral solder b...

Three-dimensional chip-to-wafer integration

Method for varied topographic MEMS cap process

Wafer-level thin chip integration

Bonded stacked wafers and methods of electroplating bonded stacked...

Semiconductor device having a buffer material and stiffener

Techniques for wafer-level processing of QFN packages

Thermal processing of silicon wafers

Patents Applicationslast 30 patents

THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION

BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...

TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES

METHOD FOR VARIED TOPOGRAPHIC MEMS CAP PROCESS

SEMICONDUCTOR DEVICE HAVING A BUFFER MATERIAL AND STIFFENER

WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...

FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS

TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES

THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION

BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...

PREVENTING CONTACT STICTION IN MICRO RELAYS

Thermal Processing of Silicon Wafers

Reduced Leakage within a Semiconductor Device

Method to reduce semiconductor device leakage