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Amit Sureshkumar Nangia
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Murphy, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
IC having a metal ring thereon for stress reduction
Patent number
11,869,820
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Strain-induced shift mitigation in semiconductor packages
Patent number
11,430,747
Issue date
Aug 30, 2022
Texas Instruments Incorporated
Gregory Thomas Ostrowicki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC having a metal ring thereon for stress reduction
Patent number
11,387,155
Issue date
Jul 12, 2022
Texas Instruments Incorporated
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with filler particles in a mold compound
Patent number
11,139,178
Issue date
Oct 5, 2021
Texas Instruments Incorporated
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with a wire bond mesh
Patent number
11,121,049
Issue date
Sep 14, 2021
Texas Instruments Incorporated
Siva Prakash Gurrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with filler particles in a mold compound
Patent number
10,446,414
Issue date
Oct 15, 2019
Texas Instruments Incorporated
Amit Sureshkumar Nangia
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor package with a wire bond mesh
Patent number
10,204,842
Issue date
Feb 12, 2019
Texas Instruments Incorporated
Siva Prakash Gurrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosion-resistant copper bonds to aluminum
Patent number
9,646,950
Issue date
May 9, 2017
Texas Instruments Incorporated
Kejun Zeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL
Publication number
20230102688
Publication date
Mar 30, 2023
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRAIN-INDUCED SHIFT MITIGATION IN SEMICONDUCTOR PACKAGES
Publication number
20220415824
Publication date
Dec 29, 2022
TEXAS INSTRUMENTS INCORPORATED
Gregory Thomas Ostrowicki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
Publication number
20220336304
Publication date
Oct 20, 2022
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH REDUCED STRESS
Publication number
20220246489
Publication date
Aug 4, 2022
TEXAS INSTRUMENTS INCORPORATED
Gregory Thomas Ostrowicki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRAIN-INDUCED SHIFT MITIGATION IN SEMICONDUCTOR PACKAGES
Publication number
20220208695
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
Gregory Thomas Ostrowicki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH REDUCED STRESS
Publication number
20210296196
Publication date
Sep 23, 2021
TEXAS INSTRUMENTS INCORPORATED
Gregory Thomas Ostrowicki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
Publication number
20210183717
Publication date
Jun 17, 2021
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar Nangia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND
Publication number
20200043753
Publication date
Feb 6, 2020
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar NANGIA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND
Publication number
20190198352
Publication date
Jun 27, 2019
TEXAS INSTRUMENTS INCORPORATED
Amit Sureshkumar NANGIA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
Publication number
20190172766
Publication date
Jun 6, 2019
TEXAS INSTRUMENTS INCORPORATED
Siva Prakash Gurrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
Publication number
20180233422
Publication date
Aug 16, 2018
TEXAS INSTRUMENTS INCORPORATED
Siva Prakash Gurrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION-RESISTANT COPPER BONDS TO ALUMINUM
Publication number
20160181225
Publication date
Jun 23, 2016
TEXAS INSTRUMENTS INCORPORATED
Kejun Zeng
H01 - BASIC ELECTRIC ELEMENTS