Amitesh Saha

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with solder thermal interface materials...
- Patent number 12,272,614
- Issue date Apr 8, 2025
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lids for integrated circuit packages with solder thermal interface...
- Patent number 11,817,369
- Issue date Nov 14, 2023
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channeled lids for integrated circuit packages
- Patent number 11,670,569
- Issue date Jun 6, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions using self-healing polymeric thermal i...
- Patent number 11,551,997
- Issue date Jan 10, 2023
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHANNELED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200395269
- Publication date Dec 17, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE...
- Publication number 20200388554
- Publication date Dec 10, 2020
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...
- Publication number 20200381332
- Publication date Dec 3, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...
- Publication number 20200373220
- Publication date Nov 26, 2020
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER THERMAL INTERFACE MATERIAL (STIM) WITH DOPANT
- Publication number 20200357764
- Publication date Nov 12, 2020
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL I...
- Publication number 20200294886
- Publication date Sep 17, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200260609
- Publication date Aug 13, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS

Amitesh Saha

Person

Patents Grantslast 30 patents

Integrated circuit packages with solder thermal interface materials...

Solder thermal interface material (STIM) with dopant

Integrated circuit packages with thermal interface materials with d...

Lids for integrated circuit packages with solder thermal interface...

Channeled lids for integrated circuit packages

Thermal management solutions using self-healing polymeric thermal i...

Patents Applicationslast 30 patents

CHANNELED LIDS FOR INTEGRATED CIRCUIT PACKAGES

LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE...

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...

SOLDER THERMAL INTERFACE MATERIAL (STIM) WITH DOPANT

THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL I...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES