Amlan Sen

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision reconstruction for panel-level packaging
- Patent number 11,817,326
- Issue date Nov 14, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wetting processing apparatus and operation method thereof
- Patent number 11,810,797
- Issue date Nov 7, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post bond inspection of devices for panel packaging
- Patent number 11,552,043
- Issue date Jan 10, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression molding machine and method of compression molding
- Patent number 11,518,070
- Issue date Dec 6, 2022
- PYXIS CF PTE. LTD.
- Amlan Sen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Panel level packaging for devices
- Patent number 11,456,259
- Issue date Sep 27, 2022
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and operation method thereof
- Patent number 11,261,535
- Issue date Mar 1, 2022
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automation line for processing a molded panel
- Patent number 11,107,716
- Issue date Aug 31, 2021
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for encapsulation of semiconductor dies
- Patent number 9,082,775
- Issue date Jul 14, 2015
- Advanpack Solutions PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS AND OPERATION METHOD THEREOF
- Publication number 20220178044
- Publication date Jun 9, 2022
- PYXIS CF PTE. LTD.
- Amlan SEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20220102189
- Publication date Mar 31, 2022
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION RECONSTRUCTION FOR PANEL-LEVEL PACKAGING
- Publication number 20220028703
- Publication date Jan 27, 2022
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATION LINE FOR PROCESSING A MOLDED PANEL
- Publication number 20210249290
- Publication date Aug 12, 2021
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST BOND INSPECTION OF DEVICES FOR PANEL PACKAGING
- Publication number 20210118841
- Publication date Apr 22, 2021
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTING PROCESSING APPARATUS AND OPERATION METHOD THEREOF
- Publication number 20210111045
- Publication date Apr 15, 2021
- PYXIS CF PTE. LTD.
- Amlan SEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PANEL LEVEL PACKAGING FOR DEVICES
- Publication number 20200312780
- Publication date Oct 1, 2020
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION MOLDING MACHINE AND METHOD OF COMPRESSION MOLDING
- Publication number 20200307037
- Publication date Oct 1, 2020
- PYXIS CF PTE. LTD.
- AMLAN SEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PLATING APPARATUS AND OPERATION METHOD THEREOF
- Publication number 20200299854
- Publication date Sep 24, 2020
- PYXIS CF PTE. LTD.
- Amlan SEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICE BONDING
- Publication number 20200083193
- Publication date Mar 12, 2020
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME
- Publication number 20150348895
- Publication date Dec 3, 2015
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING
- Publication number 20140154037
- Publication date Jun 5, 2014
- ORION SYSTEMS INTEGRATION PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Encapsulating Semiconductor Dies
- Publication number 20110281403
- Publication date Nov 17, 2011
- PYXIS SYSTEMS INTEGRATION PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System For Encapsulation Of Semiconductor Dies
- Publication number 20110271902
- Publication date Nov 10, 2011
- Advanpack Solutions Pte Ltd
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus and method for semiconductor device bonding

Precision reconstruction for panel-level packaging

Wetting processing apparatus and operation method thereof

Post bond inspection of devices for panel packaging

Compression molding machine and method of compression molding

Panel level packaging for devices

Plating apparatus and operation method thereof

Automation line for processing a molded panel

Method for device packaging

System for encapsulation of semiconductor dies

Patents Applicationslast 30 patents

PLATING APPARATUS AND OPERATION METHOD THEREOF

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

PRECISION RECONSTRUCTION FOR PANEL-LEVEL PACKAGING

AUTOMATION LINE FOR PROCESSING A MOLDED PANEL

POST BOND INSPECTION OF DEVICES FOR PANEL PACKAGING

WETTING PROCESSING APPARATUS AND OPERATION METHOD THEREOF

PANEL LEVEL PACKAGING FOR DEVICES

COMPRESSION MOLDING MACHINE AND METHOD OF COMPRESSION MOLDING

PLATING APPARATUS AND OPERATION METHOD THEREOF

APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICE BONDING

SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME

METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

Method For Encapsulating Semiconductor Dies

System For Encapsulation Of Semiconductor Dies