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Bangkok, TH
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Patents Grants
last 30 patents
Information
Patent Grant
Method for glob top encapsulation using molding tape with elevated...
Patent number
11,637,024
Issue date
Apr 25, 2023
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Shielded electronic package and method of fabrication
Patent number
11,482,478
Issue date
Oct 25, 2022
NXP B.V.
Crispulo Estira Lictao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device, device package, and method of fabrication
Patent number
11,114,239
Issue date
Sep 7, 2021
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integral EMI shield
Patent number
11,049,817
Issue date
Jun 29, 2021
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glob top encapsulation using molding tape
Patent number
10,847,385
Issue date
Nov 24, 2020
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Press-fit semiconductor device
Patent number
10,790,220
Issue date
Sep 29, 2020
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive trace design for smart card
Patent number
10,763,203
Issue date
Sep 1, 2020
NXP B.V.
Amornthep Saiyajitara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor module with blade insert
Patent number
10,340,211
Issue date
Jul 2, 2019
NXP B.V.
Chanon Suwankasab
G01 - MEASURING TESTING
Information
Patent Grant
Lead frame with partially-etched connecting bar
Patent number
10,249,556
Issue date
Apr 2, 2019
NXP B.V.
Verapath Vareesantichai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of mounting passive electronic component on lead frame
Patent number
9,721,877
Issue date
Aug 1, 2017
Nexperia B.V.
Chanon Suwankasab
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
Publication number
20230343683
Publication date
Oct 26, 2023
NXP USA, Inc.
Stephen Ryan Hooper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SEMICONDUCTOR DIE AND...
Publication number
20230178457
Publication date
Jun 8, 2023
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
Publication number
20220028766
Publication date
Jan 27, 2022
NXP B.V.
Crispulo Estira Lictao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE, DEVICE PACKAGE, AND METHOD OF FABRICATION
Publication number
20210151251
Publication date
May 20, 2021
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
Publication number
20210035820
Publication date
Feb 4, 2021
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CONDUCTIVE TRACE DESIGN FOR SMART CARD
Publication number
20200258831
Publication date
Aug 13, 2020
NXP B.V.
Amornthep Saiyajitara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESS-FIT SEMICONDCUTOR DEVICE
Publication number
20200126895
Publication date
Apr 23, 2020
NXP B.V.
Chayathorn Saklang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLOB TOP ENCAPSULATION USING MOLDING TAPE
Publication number
20200111685
Publication date
Apr 9, 2020
NXP B.V.
Wiwat Tanwongwan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LEAD FRAME WITH PLATED LEAD TIPS
Publication number
20190229044
Publication date
Jul 25, 2019
NXP B.V.
AMORNTHEP SAIYAJITARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LEAD FRAME WITH MACHINE READABLE MARK
Publication number
20180226353
Publication date
Aug 9, 2018
NXP B.V.
Ekapong Tangpattanasaeree
H01 - BASIC ELECTRIC ELEMENTS