Amram Eitan

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two material high K thermal encapsulant system
- Patent number 10,475,715
- Issue date Nov 12, 2019
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package that includes fine powder coating
- Patent number 9,653,411
- Issue date May 16, 2017
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ formation of conductive filling material in through-silicon...
- Patent number 7,851,342
- Issue date Dec 14, 2010
- Intel Corporation
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,727,814
- Issue date Jun 1, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, system, and apparatus for filling vias
- Patent number 7,557,036
- Issue date Jul 7, 2009
- Intel Corporation
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,402,909
- Issue date Jul 22, 2008
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...
- Publication number 20230095281
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH SPACER ELEMENT
- Publication number 20190206821
- Publication date Jul 4, 2019
- Intel Corporation
- Huxiao XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLING VIA PLURALITY OF ADHESIVE ELEMENTS
- Publication number 20190202136
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099777
- Publication date Apr 4, 2019
- Intel Corporation
- Ken P. Hackenberg
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE
- Publication number 20180358296
- Publication date Dec 13, 2018
- Intel Corporation
- Eric J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20180337129
- Publication date Nov 22, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
- Publication number 20170170088
- Publication date Jun 15, 2017
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting integrated circuit components on substrates
- Publication number 20090294515
- Publication date Dec 3, 2009
- Edward R. Prack
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU FORMATION OF CONDUCTIVE FILLING MATERIAL IN THROUGH-SILICON...
- Publication number 20080242079
- Publication date Oct 2, 2008
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, system, and apparatus for filling vias
- Publication number 20070235840
- Publication date Oct 11, 2007
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low stress stacked die packages
- Publication number 20070152314
- Publication date Jul 5, 2007
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package interconnect and method of fabrication thereof
- Publication number 20060243958
- Publication date Nov 2, 2006
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Amram Eitan

Person

Patents Grantslast 30 patents

Electronic assembly that includes a bridge

Microelectronic structures having multiple microelectronic devices...

Microelectronic structures having multiple microelectronic devices...

Two material high K thermal encapsulant system

Microelectronic structures having multiple microelectronic devices...

Ablation method and recipe for wafer level underfill material patte...

Thermal compression bonding process cooling manifold

Electronic package that includes fine powder coating

Thermal compression bonding process cooling manifold

In-situ formation of conductive filling material in through-silicon...

Microelectronic package interconnect and method of fabrication thereof

Method, system, and apparatus for filling vias

Microelectronic package interconnect and method of fabrication thereof

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

SUBSTRATE ASSEMBLY WITH SPACER ELEMENT

COMPONENT COUPLING VIA PLURALITY OF ADHESIVE ELEMENTS

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM

ADAPTIVE TCB BY DATA FEED FORWARD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...

Mounting integrated circuit components on substrates

IN-SITU FORMATION OF CONDUCTIVE FILLING MATERIAL IN THROUGH-SILICON...

Method, system, and apparatus for filling vias

Low stress stacked die packages

Microelectronic package interconnect and method of fabrication thereof