Amrita Mallik

Follow

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two material high K thermal encapsulant system
- Patent number 10,475,715
- Issue date Nov 12, 2019
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
- Publication number 20170170088
- Publication date Jun 15, 2017
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS