An Andrew Zeng

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer shape and flatness measurement apparatus and method
- Patent number 11,105,753
- Issue date Aug 31, 2021
- Nanjing LiAn Semiconductor Limited
- An Andrew Zeng
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for improving the temperature stability and mi...
- Patent number 8,621,945
- Issue date Jan 7, 2014
- KLA Tencor
- An Andrew Zeng
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
TOOL ARCHITECTURE FOR WAFER GEOMETRY MEASUREMENT IN SEMICONDUCTOR I...
- Publication number 20210247178
- Publication date Aug 12, 2021
- Nanjing LiAn Semiconductor Limited
- An Andrew ZENG
- G01 - MEASURING TESTING
Information Patent Application
WAFER SHAPE AND FLATNESS MEASUREMENT APPARATUS AND METHOD
- Publication number 20210199597
- Publication date Jul 1, 2021
- Nanjing LiAn Semiconductor Limited
- An Andrew ZENG
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPAATUS FOR IMPROVING THE TEMPERATURE STABILITY AND MIN...
- Publication number 20120118061
- Publication date May 17, 2012
- KLA-Tencor Corporation
- An Andrew Zeng
- G05 - CONTROLLING REGULATING