An-Hsuan HSU

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240334586
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS