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An-Ru Cheng
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Hsin-Chu, TW
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last 30 patents
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Patent Grant
Method for minimizing product turn-around time for making semicondu...
Patent number
6,756,275
Issue date
Jun 29, 2004
Faraday Technology Corp.
Kwo-Jen Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES
Publication number
20240213110
Publication date
Jun 27, 2024
GaN Systems Inc.
An-Sheng CHENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...
Publication number
20240213127
Publication date
Jun 27, 2024
GAN SYSTEMS INC.
Abhinandan DIXIT
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS
Publication number
20230019052
Publication date
Jan 19, 2023
GaN Systems Inc.
Cameron MCKNIGHT-MACNEIL
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