An-Te Tseng

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Dayuan Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure having a plurality of insulating layers
- Patent number 10,903,136
- Issue date Jan 26, 2021
- TDK TAIWAN CORP.
- Ming-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-dissipating substrate structure
- Patent number 10,811,332
- Issue date Oct 20, 2020
- TDK TAIWAN CORP.
- Ming-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter for connecting a chip and a socker
- Patent number 6,969,266
- Issue date Nov 29, 2005
- ASUSTeK COMPUTER Inc.
- Chi-Chuan Chu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20190139860
- Publication date May 9, 2019
- TDK TAIWAN CORP.
- Ming-Hung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-DISSIPATING SUBSTRATE STRUCTURE
- Publication number 20190139854
- Publication date May 9, 2019
- TDK TAIWAN CORP.
- Ming-Hung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adapter for connecting a chip and a socker
- Publication number 20050074992
- Publication date Apr 7, 2005
- Chi-Chuan Chu
- G01 - MEASURING TESTING