Ananth PRABHAKUMAR

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Device, method and system for providing recessed interconnect struc...
- Patent number 11,355,427
- Issue date Jun 7, 2022
- Intel Corporation
- Howe Yin Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with through void guard trace
- Patent number 11,264,338
- Issue date Mar 1, 2022
- Intel Corporation
- Ananth Prabhakumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH THROUGH VOID GUARD TRACE
- Publication number 20220148981
- Publication date May 12, 2022
- Intel Corporation
- Ananth PRABHAKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH THROUGH VOID GUARD TRACE
- Publication number 20190295961
- Publication date Sep 26, 2019
- Intel Corporation
- Ananth PRABHAKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUC...
- Publication number 20190131227
- Publication date May 2, 2019
- Intel Corporation
- Howe Yin LOO
- H01 - BASIC ELECTRIC ELEMENTS