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Anas Ajaj
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Dresden, DE
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Patents Grants
last 30 patents
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Patent Grant
Combined wafer production method with a receiving layer having holes
Patent number
10,960,574
Issue date
Mar 30, 2021
Siltectra GmbH
Jan Richter
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Combined wafer production method with a multi-component receiving l...
Patent number
10,707,068
Issue date
Jul 7, 2020
Siltectra GmbH
Jan Richter
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
COMBINED WAFER PRODUCTION METHOD WITH A MULTI-COMPONENT RECEIVING L...
Publication number
20180233347
Publication date
Aug 16, 2018
SILTECTRA GMBH
Richter Jan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMBINED WAFER PRODUCTION METHOD WITH A RECEIVING LAYER HAVING HOLES
Publication number
20170217048
Publication date
Aug 3, 2017
SILTECTRA GMBH
Jan Richter
B28 - WORKING CEMENT, CLAY, OR STONE