Anca Stefanescu

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St. Charles, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for in-situ passivation of silicon-on-insulator wafers
- Patent number 8,859,393
- Issue date Oct 14, 2014
- SunEdison Semiconductor Limited
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the detection of processing-induced defects in a silicon...
- Patent number 6,600,557
- Issue date Jul 29, 2003
- MEMC Electronic Materials, Inc.
- Anca Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ULTRASONICALLY CLEAVING A BONDED WAFER PAIR
- Publication number 20150126017
- Publication date May 7, 2015
- SunEdison Semiconductor Limited (UEN201334164H)
- Anca Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
- Publication number 20120247686
- Publication date Oct 4, 2012
- MEMC Electronic Materials, Inc.
- Anca Stefanescu
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods For In-Situ Passivation Of Silicon-On-Insulator Wafers
- Publication number 20120003814
- Publication date Jan 5, 2012
- MEMC Electronic Materials, Inc.
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS