Andre Roeth

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 12,332,271
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of generating a germanium structure and optical device compr...
- Patent number 11,594,654
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Andre Roeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 11,422,151
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Producing a buried cavity in a semiconductor substrate
- Patent number 11,393,714
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Andre Roeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 11,078,072
- Issue date Aug 3, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stressed decoupled micro-electro-mechanical system sensor
- Patent number 10,870,575
- Issue date Dec 22, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive microelectromechanical device and method for forming a c...
- Patent number 10,684,306
- Issue date Jun 16, 2020
- Infineon Technologies AG
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device, method for manufacturing a microelec...
- Patent number 10,683,203
- Issue date Jun 16, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated semiconductor device and manufacturing method
- Patent number 10,544,037
- Issue date Jan 28, 2020
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor device and manufacturing method
- Patent number 10,386,255
- Issue date Aug 20, 2019
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Sensor structures, systems and methods with improved integration an...
- Patent number 10,060,816
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated semiconductor device and manufacturing method
- Patent number 9,896,329
- Issue date Feb 20, 2018
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20220326275
- Publication date Oct 13, 2022
- INFINEON TECHNOLOGIES AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF GENERATING A GERMANIUM STRUCTURE AND OPTICAL DEVICE COMPR...
- Publication number 20220069156
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Andre Roeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCING A BURIED CAVITY IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20210013087
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Andre ROETH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20200300886
- Publication date Sep 24, 2020
- INFINEON TECHNOLOGIES AG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...
- Publication number 20200290867
- Publication date Sep 17, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Thoralf KAUTZSCH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
- Publication number 20200002159
- Publication date Jan 2, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELEC...
- Publication number 20180297838
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20180155188
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD
- Publication number 20180017456
- Publication date Jan 18, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Application
SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...
- Publication number 20170089790
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20170015546
- Publication date Jan 19, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...
- Publication number 20170010301
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Steffen BIESELT
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...
- Publication number 20160185594
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Andre Roeth

Person

Patents Grantslast 30 patents

Capacitive microelectromechanical device and method for forming a c...

Method of generating a germanium structure and optical device compr...

Capacitive microelectromechanical device and method for forming a c...

Producing a buried cavity in a semiconductor substrate

Microelectromechanical device, method for manufacturing a microelec...

Stressed decoupled micro-electro-mechanical system sensor

Capacitive microelectromechanical device and method for forming a c...

Microelectromechanical device, method for manufacturing a microelec...

Integrated semiconductor device and manufacturing method

Pressure sensor device and manufacturing method

Sensor structures, systems and methods with improved integration an...

Integrated semiconductor device and manufacturing method

Patents Applicationslast 30 patents

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

METHOD OF GENERATING A GERMANIUM STRUCTURE AND OPTICAL DEVICE COMPR...

PRODUCING A BURIED CAVITY IN A SEMICONDUCTOR SUBSTRATE

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELE...

STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

MICROELECTROMECHANICAL DEVICE, METHOD FOR MANUFACTURING A MICROELEC...

INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD

SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AN...

INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

CAPACITIVE MICROELECTROMECHANICAL DEVICE AND METHOD FOR FORMING A C...

SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENS...