Andre Schenk

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Hofstetten, DE

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Patents Grantslast 30 patents

Information Patent Grant
Strained semiconductor device and method of making the same
- Patent number 9,559,204
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Helmut Horst Tews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the solder-stop structuring of elevations on wafers
- Patent number 6,919,264
- Issue date Jul 19, 2005
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Strained Semiconductor Device and Method of Making the Same
- Publication number 20150123201
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Helmut Horst Tews
- H01 - BASIC ELECTRIC ELEMENTS