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Andrea Chen
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San Jose, CA, US
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last 30 patents
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Patent Grant
Method and apparatus for second order intercept point (IP2) calibra...
Patent number
11,067,702
Issue date
Jul 20, 2021
Samsung Electronics Co., Ltd.
Daniel Babitch
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for second order intercept point (IP2) calibra...
Patent number
10,775,512
Issue date
Sep 15, 2020
Samsung Electronics Co., Ltd.
Daniel Babitch
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for second order intercept point (IP2) calibra...
Patent number
10,317,535
Issue date
Jun 11, 2019
Samsung Electronics Co., Ltd.
Daniel Babitch
G01 - MEASURING TESTING
Information
Patent Grant
Chip scale package with flip chip interconnect
Patent number
6,737,295
Issue date
May 18, 2004
ChipPAC, Inc.
Rajendra Pendse
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD AND APPARATUS FOR SECOND ORDER INTERCEPT POINT (IP2) CALIBRA...
Publication number
20200408924
Publication date
Dec 31, 2020
SAMSUNG ELECTRONICS CO., LTD.
Daniel BABITCH
G01 - MEASURING TESTING
Information
Patent Application
METHOD AND APPARATUS FOR SECOND ORDER INTERCEPT POINT (IP2) CALIBRA...
Publication number
20190285755
Publication date
Sep 19, 2019
SAMSUNG ELECTRONICS CO., LTD.
Daniel BABITCH
G01 - MEASURING TESTING
Information
Patent Application
METHOD AND APPARATUS FOR SECOND ORDER INTERCEPT POINT (IP2) CALIBRA...
Publication number
20170285172
Publication date
Oct 5, 2017
Samsung Electronics Co., Ltd.
Daniel BABITCH
G01 - MEASURING TESTING
Information
Patent Application
System and Methods for Supporting Multiple Communications Protocols...
Publication number
20100216506
Publication date
Aug 26, 2010
AUGUSTA TECHNOLOGY, INC.
Tung Chang
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Chip scale package with flip chip interconnect
Publication number
20040222440
Publication date
Nov 11, 2004
ChipPAC, Inc.
Rajendra Pendse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip scale package with flip chip interconnect
Publication number
20020151189
Publication date
Oct 17, 2002
ChipPAC, Inc.
Rajendra Pendse
H01 - BASIC ELECTRIC ELEMENTS