Andrea Giovanni Cigada

Person

Milano, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of an electronic device package
- Patent number 7,238,014
- Issue date Jul 3, 2007
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame for semiconductor devices
- Patent number 7,075,172
- Issue date Jul 11, 2006
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device with objective slidable engaged with support structure
- Patent number 6,842,300
- Issue date Jan 11, 2005
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Leadframe for integrated circuit chips having low resistance connec...
- Patent number 6,838,755
- Issue date Jan 4, 2005
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic device package
- Patent number 6,811,738
- Issue date Nov 2, 2004
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated leadframes with cantilevered leads
- Patent number 6,518,099
- Issue date Feb 11, 2003
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated leadframes with cantilevered leads
- Patent number 6,323,544
- Issue date Nov 27, 2001
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing semiconductor packages comprising an inte...
- Patent number 6,087,202
- Issue date Jul 11, 2000
- STMicroelectronics S.A.
- Juan Exposito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Manufacturing method of an electronic device package
- Publication number 20050085033
- Publication date Apr 21, 2005
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical device, in particular image detector
- Publication number 20030107825
- Publication date Jun 12, 2003
- STMicroelectronics S.r. I.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Process for cleaning an integrated circuit package surface, for pre...
- Publication number 20030051738
- Publication date Mar 20, 2003
- STMicroelectronics S.r.l.
- Andrea Cigada
- B08 - CLEANING
Information Patent Application
Manufacturing method of an electronic device package
- Publication number 20020093120
- Publication date Jul 18, 2002
- STMicroelectronics S.r. I.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe for chips, having low resistance connections
- Publication number 20020043701
- Publication date Apr 18, 2002
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame for semiconductor devices
- Publication number 20020033523
- Publication date Mar 21, 2002
- STMicroelectronics S.r.l.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plated leadframes with cantilevered leads
- Publication number 20010041385
- Publication date Nov 15, 2001
- STMicroelectronics S.r.I.
- Andrea Giovanni Cigada
- H01 - BASIC ELECTRIC ELEMENTS

Andrea Giovanni Cigada

Person

Patents Grantslast 30 patents

Manufacturing method of an electronic device package

Lead-frame for semiconductor devices

Optical device with objective slidable engaged with support structure

Leadframe for integrated circuit chips having low resistance connec...

Manufacturing method of an electronic device package

Plated leadframes with cantilevered leads

Plated leadframes with cantilevered leads

Process for manufacturing semiconductor packages comprising an inte...

Patents Applicationslast 30 patents

Manufacturing method of an electronic device package

Optical device, in particular image detector

Process for cleaning an integrated circuit package surface, for pre...

Manufacturing method of an electronic device package

Leadframe for chips, having low resistance connections

Lead-frame for semiconductor devices

Plated leadframes with cantilevered leads