Andreas Bauer

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Landshut, DE

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Patents Grantslast 30 patents

Information Patent Grant
Separation of workpiece with three material removal stages
- Patent number 10,403,506
- Issue date Sep 3, 2019
- Infineon Technologies AG
- Christoph Kamseder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,356,092
- Issue date May 31, 2016
- Infineon Technologies AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE
- Publication number 20240145408
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Maria HEIDENBLUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
- Publication number 20220270985
- Publication date Aug 25, 2022
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of workpiece with three material removal stages
- Publication number 20190214299
- Publication date Jul 11, 2019
- INFINEON TECHNOLOGIES AG
- Christoph Kamseder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing a Semiconductor D...
- Publication number 20150069576
- Publication date Mar 12, 2015
- INFINEON TECHNOLOGIES AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS