Andreas Bischof

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a package for semiconductor chips
- Patent number 7,326,593
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of producing a package for semiconductor chips
- Publication number 20060211166
- Publication date Sep 21, 2006
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS