Andreas C. Pfahnl

Person

Londonderry, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic system with non-parallel arrays of circuit card assemblies
- Patent number 7,978,476
- Issue date Jul 12, 2011
- Amphenol Corporation
- Christopher Heard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector lead frame
- Patent number 7,794,278
- Issue date Sep 14, 2010
- Amphenol Corporation
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular rackmount chiller
- Patent number 7,484,552
- Issue date Feb 3, 2009
- Amphenol Corporation
- Andreas C. Pfahnl
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Air cooling architecture for orthogonal board architectures
- Patent number 7,280,356
- Issue date Oct 9, 2007
- Amphenol Corporation
- Andreas C. Pfahnl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced pressure regulation of electronics cooling system
- Patent number 7,257,000
- Issue date Aug 14, 2007
- Amphenol Corporation
- Andreas C. Pfahnl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor handler for rapid testing
- Patent number 6,717,115
- Issue date Apr 6, 2004
- Teradyne, Inc.
- Andreas C. Pfahnl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control structure
- Patent number 6,448,575
- Issue date Sep 10, 2002
- Teradyne, Inc.
- Alexander H. Slocum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for temperature control of a semiconductor ele...
- Patent number 6,091,062
- Issue date Jul 18, 2000
- Kinetrix, Inc.
- Andreas C. Pfahnl
- G01 - MEASURING TESTING
Information Patent Grant
Heat-transfer enhancing features for semiconductor carriers and dev...
- Patent number 6,036,023
- Issue date Mar 14, 2000
- Teradyne, Inc.
- Andreas C. Pfahnl
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTOR LEAD FRAME
- Publication number 20080248658
- Publication date Oct 9, 2008
- Thomas S. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air cooling architecture for orthogonal board architectures
- Publication number 20060126292
- Publication date Jun 15, 2006
- Andreas C. Pfahnl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic system with non-parallel arrays of circuit card assemblies
- Publication number 20060067069
- Publication date Mar 30, 2006
- Christopher Heard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally enhanced pressure regulation of electronics cooling systems
- Publication number 20060007657
- Publication date Jan 12, 2006
- Teradyne, Inc.
- Andreas C. Pfahnl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular rackmount chiller
- Publication number 20050133214
- Publication date Jun 23, 2005
- Teradyne, Inc.
- Andreas C. Pfahnl
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Two-phase cooling apparatus and method for automatic test equipment
- Publication number 20050039888
- Publication date Feb 24, 2005
- Andreas C. Pfahnl
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...

Andreas C. Pfahnl

Person

Patents Grantslast 30 patents

Electronic system with non-parallel arrays of circuit card assemblies

Electrical connector lead frame

Modular rackmount chiller

Air cooling architecture for orthogonal board architectures

Thermally enhanced pressure regulation of electronics cooling system

Semiconductor handler for rapid testing

Temperature control structure

Method and apparatus for temperature control of a semiconductor ele...

Heat-transfer enhancing features for semiconductor carriers and dev...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTOR LEAD FRAME

Air cooling architecture for orthogonal board architectures

Electronic system with non-parallel arrays of circuit card assemblies

Thermally enhanced pressure regulation of electronics cooling systems

Modular rackmount chiller

Two-phase cooling apparatus and method for automatic test equipment