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Andreas Huschka
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Dresden, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-layer printed circuit board comprising a through connection f...
Patent number
7,394,027
Issue date
Jul 1, 2008
Advanced Micro Devices, Inc.
Heiko Kaluzni
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
ESD protection circuit for radio frequency input/output terminals i...
Patent number
7,224,949
Issue date
May 29, 2007
Advanced Micro Devices, Inc.
Wolfram Kluge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit and a method for controlling the bias current in a switched...
Patent number
6,891,439
Issue date
May 10, 2005
Advanced Micro Devices, Inc.
Rolf Jaehne
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
Multi-layer printed circuit board comprising a through connection f...
Publication number
20060131611
Publication date
Jun 22, 2006
Heiko Kaluzni
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor die package having two die paddles
Publication number
20040159929
Publication date
Aug 19, 2004
Andreas Huschka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit and a method for controlling the bias current in a switched...
Publication number
20040085135
Publication date
May 6, 2004
Rolf Jaehne
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
ESD protection circuit for radio frequency input/output terminals i...
Publication number
20030183403
Publication date
Oct 2, 2003
Wolfram Kluge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor die package having two die paddles
Publication number
20030151123
Publication date
Aug 14, 2003
Andreas Huschka
H01 - BASIC ELECTRIC ELEMENTS