Andreas Kucher

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Villach, AT

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with leadframe interconnection structure
- Patent number 11,444,011
- Issue date Sep 13, 2022
- Infineon Technologies AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with leadframe interconnection structure
- Patent number 10,872,848
- Issue date Dec 22, 2020
- Infineon Technologies AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase half bridge driver package and methods of manufacture
- Patent number 10,396,018
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Leadframe Interconnection Structure
- Publication number 20210066172
- Publication date Mar 4, 2021
- INFINEON TECHNOLOGIES AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Leadframe Interconnection Structure
- Publication number 20200135626
- Publication date Apr 30, 2020
- INFINEON TECHNOLOGIES AG
- Woon Yik Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
- Publication number 20190164873
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS