Andreas Lenniger

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Anroechte, DE

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and electronic system that receives and processes...
- Patent number 11,889,246
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Wolfgang Budde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,963,321
- Issue date Feb 24, 2015
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,519,532
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection between a semiconductor housing and a base plate compris...
- Patent number 7,932,598
- Issue date Apr 26, 2011
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system for bonding a semiconductor element
- Patent number 7,654,434
- Issue date Feb 2, 2010
- Infineon Technologies AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC SYSTEM WITH CRITICAL CONDITION DET...
- Publication number 20240098389
- Publication date Mar 21, 2024
- INFINEON TECHNOLOGIES AG
- Wolfgang Budde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC SYSTEM THAT RECEIVES AND PROCESSES...
- Publication number 20240015417
- Publication date Jan 11, 2024
- Wolfgang Budde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130134572
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130062750
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, Device and System for Bonding a Semiconductor Element
- Publication number 20060208037
- Publication date Sep 21, 2006
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection between a semiconductor housing and a base plate compris...
- Publication number 20060151872
- Publication date Jul 13, 2006
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS